Xiang Gao

Person

Edison, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dielectric passivation for layered structures
- Patent number 11,133,408
- Issue date Sep 28, 2021
- IQE PLC
- Oleg Laboutin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including buffer with strain compensation l...
- Patent number 8,981,382
- Issue date Mar 17, 2015
- IQE RF, LLC
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III-nitride enhancement mode field effect devices and fabrica...
- Patent number 8,344,421
- Issue date Jan 1, 2013
- IQE RF, LLC
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PIN diode structure with zinc diffusion region
- Patent number 8,022,495
- Issue date Sep 20, 2011
- Emcore Corporation
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill for light emitting device
- Patent number 7,843,074
- Issue date Nov 30, 2010
- Lumination LLC
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package for very small footprint and low profile white...
- Patent number 7,718,449
- Issue date May 18, 2010
- Lumination LLC
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized contact design for thermosonic bonding of flip-chip devices
- Patent number 7,667,236
- Issue date Feb 23, 2010
- Lumination LLC
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PIN diode structure with zinc diffusion region
- Patent number 7,538,403
- Issue date May 26, 2009
- Emcore Corporation
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PIN photodiode structure and fabrication process for reducing diele...
- Patent number 7,439,599
- Issue date Oct 21, 2008
- Emcore Corporation
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with series-connected monolithically integrated mesas
- Patent number 7,285,801
- Issue date Oct 23, 2007
- Lumination, LLC
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased light extraction from a nitride LED
- Patent number 7,125,734
- Issue date Oct 24, 2006
- Gelcore, LLC
- Michael J. Sackrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser separation of encapsulated submount
- Patent number 7,087,463
- Issue date Aug 8, 2006
- Gelcore, LLC
- Michael Sackrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral conduction Schottky diode with plural mesas
- Patent number 7,084,475
- Issue date Aug 1, 2006
- Velox Semiconductor Corporation
- Bryan S. Shelton
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIELECTRIC PASSIVATION FOR LAYERED STRUCTURES
- Publication number 20210043760
- Publication date Feb 11, 2021
- IQE plc
- Oleg Laboutin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Including Buffer With Strain Compensation L...
- Publication number 20140252366
- Publication date Sep 11, 2014
- IQE RF, LLC
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III-NITRIDE ENHANCEMENT MODE FIELD EFFECT DEVICES AND FABRICA...
- Publication number 20110278644
- Publication date Nov 17, 2011
- IQE RF, LLC
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER LIFT-OFF WITH IMPROVED LIGHT EXTRACTION
- Publication number 20100181584
- Publication date Jul 22, 2010
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pin Diode Structure with Zinc Diffusion Region
- Publication number 20090230497
- Publication date Sep 17, 2009
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBUST DIE BONDING PROCESS FOR LED DIES
- Publication number 20090155958
- Publication date Jun 18, 2009
- Boris Kolodin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Small footprint high power light emitting package with plurality of...
- Publication number 20080121902
- Publication date May 29, 2008
- GELCORE LLC
- Michael Sackrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill for light emitting device
- Publication number 20080061312
- Publication date Mar 13, 2008
- GELCORE LLC
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Mount Light Emitting Chip Package
- Publication number 20080035947
- Publication date Feb 14, 2008
- Stanton Earl Weaver Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level package for very small footprint and low profile white...
- Publication number 20070202623
- Publication date Aug 30, 2007
- GELCORE LLC
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optimized contact design for thermosonic bonding of flip-chip devices
- Publication number 20070145379
- Publication date Jun 28, 2007
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser separation of encapsulated submount
- Publication number 20070004088
- Publication date Jan 4, 2007
- GELCORE, LLC
- Michael Sackrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASED LIGHT EXTRACTION FROM A NITRIDE LED
- Publication number 20060202223
- Publication date Sep 14, 2006
- GELCORE LLC
- Michael J. Sackrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN photodiode structure and fabrication process for reducing diele...
- Publication number 20060076589
- Publication date Apr 13, 2006
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN diode structure with zinc diffusion region
- Publication number 20060060933
- Publication date Mar 23, 2006
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser separation of encapsulated submount
- Publication number 20060030125
- Publication date Feb 9, 2006
- GELCORE, LLC
- Michael Sackrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED with series-connected monolithically integrated mesas
- Publication number 20050225973
- Publication date Oct 13, 2005
- GELCORE, LLC
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lateral conduction schottky diode with plural mesas
- Publication number 20050179104
- Publication date Aug 18, 2005
- Emcore Corporation
- Bryan S. Shelton
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Dielectric passivation for layered structures

Semiconductor structure including buffer with strain compensation l...

Group III-nitride enhancement mode field effect devices and fabrica...

PIN diode structure with zinc diffusion region

Underfill for light emitting device

Wafer level package for very small footprint and low profile white...

Optimized contact design for thermosonic bonding of flip-chip devices

PIN diode structure with zinc diffusion region

PIN photodiode structure and fabrication process for reducing diele...

LED with series-connected monolithically integrated mesas

Increased light extraction from a nitride LED

Laser separation of encapsulated submount

Lateral conduction Schottky diode with plural mesas

Patents Applicationslast 30 patents

DIELECTRIC PASSIVATION FOR LAYERED STRUCTURES

Semiconductor Structure Including Buffer With Strain Compensation L...

GROUP III-NITRIDE ENHANCEMENT MODE FIELD EFFECT DEVICES AND FABRICA...

LASER LIFT-OFF WITH IMPROVED LIGHT EXTRACTION

Pin Diode Structure with Zinc Diffusion Region

ROBUST DIE BONDING PROCESS FOR LED DIES

Small footprint high power light emitting package with plurality of...

Underfill for light emitting device

Surface Mount Light Emitting Chip Package

Wafer level package for very small footprint and low profile white...

Optimized contact design for thermosonic bonding of flip-chip devices

Laser separation of encapsulated submount

INCREASED LIGHT EXTRACTION FROM A NITRIDE LED

PIN photodiode structure and fabrication process for reducing diele...

PIN diode structure with zinc diffusion region

Laser separation of encapsulated submount

LED with series-connected monolithically integrated mesas

Lateral conduction schottky diode with plural mesas