Xiang Wang

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Shangha City, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming substrate with buried insulating layer
- Patent number 8,633,090
- Issue date Jan 21, 2014
- Shanghai Simgui Technology Co., Ltd.
- Xiang Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING SUBSTRATE WITH BURIED INSULATING LAYER
- Publication number 20120122299
- Publication date May 17, 2012
- SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY...
- Xiang Wang
- H01 - BASIC ELECTRIC ELEMENTS