Xiang Yin Zeng

Person

Pu Dong, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip assembly with optically coupled die
- Patent number 8,189,361
- Issue date May 29, 2012
- Intel Corporation
- Qing A. Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated capacitors in package-level structures, processes of mak...
- Patent number 7,989,916
- Issue date Aug 2, 2011
- Intel Corporation
- John J. Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper plating connection for multi-die stack in substrate package
- Patent number 7,981,726
- Issue date Jul 19, 2011
- Intel Corporation
- John J. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged spiral inductor structures, processes of making same, and...
- Patent number 7,852,189
- Issue date Dec 14, 2010
- Intel Corporation
- Jiangqi He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip assembly with optically coupled die
- Patent number 7,851,809
- Issue date Dec 14, 2010
- Intel Corporation
- Qing A. Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual heat spreader panel assembly method for bumpless die-attach pa...
- Patent number 7,723,164
- Issue date May 25, 2010
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with lossy material insert
- Patent number 7,714,430
- Issue date May 11, 2010
- Intel Corporation
- Xiang Yin Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package level noise isolation
- Patent number 7,709,934
- Issue date May 4, 2010
- Intel Corporation
- Xiang Yin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated capacitors in package-level structures, processes of mak...
- Patent number 7,670,919
- Issue date Mar 2, 2010
- Intel Corporation
- John J. Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-chip integrated heat spreader assembly, packages containing sa...
- Patent number 7,659,143
- Issue date Feb 9, 2010
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip assembly with optically coupled die
- Patent number 7,564,066
- Issue date Jul 21, 2009
- Intel Corporation
- Qing A. Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing parasitic mutual capacitances
- Patent number 7,535,080
- Issue date May 19, 2009
- Intel Corporation
- Xiang Yin Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing input capacitance of high speed integrated circuits
- Patent number 7,535,689
- Issue date May 19, 2009
- Intel Corporation
- Xiang Yin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual die package with high-speed interconnect
- Patent number 7,511,359
- Issue date Mar 31, 2009
- Intel Corporation
- John J. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package level integration of antenna and RF front-end module
- Patent number 7,477,197
- Issue date Jan 13, 2009
- Intel Corporation
- Xiang Yin Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Array capacitor apparatuses to filter input/output signal
- Patent number 7,348,661
- Issue date Mar 25, 2008
- Intel Corporation
- Hyunjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with signal land pads
- Patent number 7,227,247
- Issue date Jun 5, 2007
- Intel Corporation
- Xiang Yin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended thin film capacitor (TFC)
- Patent number 7,123,466
- Issue date Oct 17, 2006
- Intel Corporation
- Jiangqi He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extended thin film capacitor (TFC)
- Patent number 7,027,289
- Issue date Apr 11, 2006
- Intel Corporation
- Jiangqi He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP ASSEMBLY WITH OPTICALLY COUPLED DIE
- Publication number 20110058419
- Publication date Mar 10, 2011
- Qing A. Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated capacitors in package-level structures, processes of mak...
- Publication number 20100059858
- Publication date Mar 11, 2010
- John J. Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-chip assembly with optically coupled die
- Publication number 20090250707
- Publication date Oct 8, 2009
- Qing A. Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Including a Microprocessor & Fourth Level Cache
- Publication number 20090039482
- Publication date Feb 12, 2009
- Jiangqi He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing input capacitance for high speed integrated circuits
- Publication number 20080316662
- Publication date Dec 25, 2008
- Xiang Yin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Strip patterned transmission line
- Publication number 20080157335
- Publication date Jul 3, 2008
- Jia Miao Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked die package with die interconnects
- Publication number 20080157324
- Publication date Jul 3, 2008
- Jia Miao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LEVEL INTEGRATION OF ANTENNA AND RF FRONT-END MODULE
- Publication number 20080158063
- Publication date Jul 3, 2008
- Xiang Yin ZENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Double side stacked die package
- Publication number 20080157322
- Publication date Jul 3, 2008
- Jia Miao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package level noise isolation
- Publication number 20080157294
- Publication date Jul 3, 2008
- Xiang Yin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Increasing the resistance of a high frequency input/output power de...
- Publication number 20080145977
- Publication date Jun 19, 2008
- Xiang Yin Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate with lossy material insert
- Publication number 20080102565
- Publication date May 1, 2008
- Xiang Yin Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL-CHIP INTEGRATED HEAT SPREADER ASSEMBLY, PACKAGES CONTAINING SA...
- Publication number 20080079144
- Publication date Apr 3, 2008
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated capacitors in package-level structures, processes of mak...
- Publication number 20070158818
- Publication date Jul 12, 2007
- John J. Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA SIGNAL INTERCONNECTION WITH REDUCED CROSSTALK
- Publication number 20070155195
- Publication date Jul 5, 2007
- Jiangqi He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged spiral inductor structures, processes of making same, and...
- Publication number 20070152796
- Publication date Jul 5, 2007
- Jiangqi He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual die package with high-speed interconnect
- Publication number 20070152312
- Publication date Jul 5, 2007
- Intel Corporation
- John J. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plating bar design for high speed package design
- Publication number 20070145543
- Publication date Jun 28, 2007
- Xiang Yin Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Complementary inductor structures
- Publication number 20070146105
- Publication date Jun 28, 2007
- Xiang Yin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper plating connection for multi-die stack in substrate package
- Publication number 20070132082
- Publication date Jun 14, 2007
- Intel Corporation
- John J. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip assembly with optically coupled die
- Publication number 20070102733
- Publication date May 10, 2007
- Qing A. Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing parasitic mutual capacitances
- Publication number 20070001260
- Publication date Jan 4, 2007
- Xiang Yin Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IC package with signal land pads
- Publication number 20060180905
- Publication date Aug 17, 2006
- Intel Corporation
- Xiang Yin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming in package integrated capacitors and structures...
- Publication number 20060124985
- Publication date Jun 15, 2006
- Xiang Yin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming in package integrated capacitors and structures...
- Publication number 20060081998
- Publication date Apr 20, 2006
- Xiang Yin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Array capacitor apparatuses to filter input/output signal
- Publication number 20060071341
- Publication date Apr 6, 2006
- Intel Corporation
- Hyunjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extended thin film capacitor (TFC)
- Publication number 20050281008
- Publication date Dec 22, 2005
- Intel Corporation
- Jiangqi He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXTENDED THIN FILM CAPACITOR (TFC)
- Publication number 20050213281
- Publication date Sep 29, 2005
- Intel Corporation
- Jiangqi He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Xiang Yin Zeng

Person

Patents Grantslast 30 patents

Multi-chip assembly with optically coupled die

Integrated capacitors in package-level structures, processes of mak...

Copper plating connection for multi-die stack in substrate package

Packaged spiral inductor structures, processes of making same, and...

Multi-chip assembly with optically coupled die

Dual heat spreader panel assembly method for bumpless die-attach pa...

Substrate with lossy material insert

Package level noise isolation

Integrated capacitors in package-level structures, processes of mak...

Dual-chip integrated heat spreader assembly, packages containing sa...

Multi-chip assembly with optically coupled die

Reducing parasitic mutual capacitances

Reducing input capacitance of high speed integrated circuits

Dual die package with high-speed interconnect

Package level integration of antenna and RF front-end module

Array capacitor apparatuses to filter input/output signal

IC package with signal land pads

Extended thin film capacitor (TFC)

Extended thin film capacitor (TFC)

Patents Applicationslast 30 patents

MULTI-CHIP ASSEMBLY WITH OPTICALLY COUPLED DIE

Integrated capacitors in package-level structures, processes of mak...

Multi-chip assembly with optically coupled die

Package Including a Microprocessor & Fourth Level Cache

Reducing input capacitance for high speed integrated circuits

Strip patterned transmission line

Stacked die package with die interconnects

PACKAGE LEVEL INTEGRATION OF ANTENNA AND RF FRONT-END MODULE

Double side stacked die package

Package level noise isolation

Increasing the resistance of a high frequency input/output power de...

Substrate with lossy material insert

DUAL-CHIP INTEGRATED HEAT SPREADER ASSEMBLY, PACKAGES CONTAINING SA...

Integrated capacitors in package-level structures, processes of mak...

DATA SIGNAL INTERCONNECTION WITH REDUCED CROSSTALK

Packaged spiral inductor structures, processes of making same, and...

Dual die package with high-speed interconnect

Plating bar design for high speed package design

Complementary inductor structures

Copper plating connection for multi-die stack in substrate package

Multi-chip assembly with optically coupled die

Reducing parasitic mutual capacitances

IC package with signal land pads

Methods of forming in package integrated capacitors and structures...

Methods of forming in package integrated capacitors and structures...

Array capacitor apparatuses to filter input/output signal

Extended thin film capacitor (TFC)

EXTENDED THIN FILM CAPACITOR (TFC)