XIANGLIN ZENG

Person

MONTEREY PARK, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Alloy bonded graphene sheets for enhanced thermal spreaders
- Patent number 10,182,493
- Issue date Jan 15, 2019
- Northrop Grumman Systems Corporation
- John A. Starkovich
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Micro hermetic sensor
- Patent number 10,132,712
- Issue date Nov 20, 2018
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large-scale reconfigurable electronics using low cost nanoparticle...
- Patent number 10,091,888
- Issue date Oct 2, 2018
- Northrop Grumman Systems Corporation
- Xing Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical cavity surface emitting laser with composite reflectors
- Patent number 9,735,545
- Issue date Aug 15, 2017
- Northrop Grumman Systems Corporation
- Yaochung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alloy bonded graphene sheets for enhanced thermal spreaders
- Patent number 9,736,923
- Issue date Aug 15, 2017
- Northrop Grumman Systems Corporation
- John A. Starkovich
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Yield enhancing vertical redundancy method for 3D wafer level packa...
- Patent number 9,425,110
- Issue date Aug 23, 2016
- Northrop Grumman Systems Corporation
- Jose G. Padilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated micro-plasma limiter
- Patent number 9,054,500
- Issue date Jun 9, 2015
- Northrop Grumman Systems Corporation
- Patty Chang-Chien
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wafer level packaging integrated hydrogen getter
- Patent number 7,777,318
- Issue date Aug 17, 2010
- Northrop Grumman Systems Corporation
- Kelly Jill Tornquist Hennig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of batch integration of low dielectric substrates with MMICs
- Patent number 7,696,062
- Issue date Apr 13, 2010
- Northrop Grumman Systems Corporation
- Patty Pei-Ling Chang-Chien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ALLOY BONDED GRAPHENE SHEETS FOR ENHANCED THERMAL SPREADERS
- Publication number 20180206328
- Publication date Jul 19, 2018
- Northrop Grumman Systems Corporation
- John A. Starkovich
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LARGE-SCALE RECONFIGURABLE ELECTRONICS USING LOW-COST NANOPARTICLE...
- Publication number 20170223838
- Publication date Aug 3, 2017
- Northrop Grumman Systems Corporation
- Xing Lan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
INTEGRATED MICRO-PLASMA LIMITER
- Publication number 20130321969
- Publication date Dec 5, 2013
- Northrop Grumman Systems Corporation
- PATTY CHANG-CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Batch Integration of Low Dielectric Substrates with MMICs
- Publication number 20090029554
- Publication date Jan 29, 2009
- Northrop Grumman Space & Mission Systems Corp.
- Patty Pei-Ling Chang-Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Packaging Integrated Hydrogen Getter
- Publication number 20090026598
- Publication date Jan 29, 2009
- Northrop Grumman Space & Mission Systems Corp.
- Kelly Jill Tornquist Hennig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Backside Metallization for Semiconductor Substrate
- Publication number 20090026619
- Publication date Jan 29, 2009
- Northrop Grumman Space & Mission Systems Corp.
- Xianglin Zeng
- H01 - BASIC ELECTRIC ELEMENTS

XIANGLIN ZENG

Person

Patents Grantslast 30 patents

Alloy bonded graphene sheets for enhanced thermal spreaders

Micro hermetic sensor

Large-scale reconfigurable electronics using low cost nanoparticle...

Vertical cavity surface emitting laser with composite reflectors

Alloy bonded graphene sheets for enhanced thermal spreaders

Yield enhancing vertical redundancy method for 3D wafer level packa...

Integrated micro-plasma limiter

Wafer level packaging integrated hydrogen getter

Method of batch integration of low dielectric substrates with MMICs

Patents Applicationslast 30 patents

ALLOY BONDED GRAPHENE SHEETS FOR ENHANCED THERMAL SPREADERS

LARGE-SCALE RECONFIGURABLE ELECTRONICS USING LOW-COST NANOPARTICLE...

INTEGRATED MICRO-PLASMA LIMITER

Method of Batch Integration of Low Dielectric Substrates with MMICs

Wafer Level Packaging Integrated Hydrogen Getter

Method for Backside Metallization for Semiconductor Substrate