Xiangsheng PAN

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Tsuen Wan, HK

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Patents Grantslast 30 patents

Information Patent Grant
Collet mounting assembly for a die bonder
- Patent number 8,215,648
- Issue date Jul 10, 2012
- ASM Assembly Automation LTD
- Xiangsheng Pan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
COLLET MOUNTING ASSEMBLY FOR A DIE BONDER
- Publication number 20090261537
- Publication date Oct 22, 2009
- Xiangsheng PAN
- H01 - BASIC ELECTRIC ELEMENTS