XIANLU CUI

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SHANGHAI, CN

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Patents Grantslast 30 patents

Information Patent Grant
Mold compound dispensing system and method
- Patent number 12,083,715
- Issue date Sep 10, 2024
- Morgan, Lewis & Bockius LLP
- Xianlu Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor device with side grooves
- Patent number 11,894,343
- Issue date Feb 6, 2024
- Western Digital Technologies, Inc.
- Xianlu Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sloped interconnector for stacked die package
- Patent number 11,756,932
- Issue date Sep 12, 2023
- SanDisk Technologies LLC
- Xianlu Cui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Mold Compound Dispensing System and Method
- Publication number 20230173720
- Publication date Jun 8, 2023
- Western Digital Technologies, Inc.
- Xianlu Cui
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE WITH SIDE GROOVES
- Publication number 20220375899
- Publication date Nov 24, 2022
- Western Digital Technologies, Inc.
- Xianlu Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOPED INTERCONNECTOR FOR STACKED DIE PACKAGE
- Publication number 20210407967
- Publication date Dec 30, 2021
- Western Digital Technologies, Inc.
- XIANLU CUI
- H01 - BASIC ELECTRIC ELEMENTS