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last 30 patents
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Patent Grant
Additive C capable of changing microvia-filling method by TSV coppe...
Patent number
9,915,005
Issue date
Mar 13, 2018
SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD.
Su Wang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Additive for reducing voids after annealing of copper plating with...
Patent number
9,856,572
Issue date
Jan 2, 2018
Su Wang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Patents Applications
last 30 patents
Information
Patent Application
A METHOD FOR MICROVIA FILLING BY COPPER ELECTROPLATING WITH TSV TEC...
Publication number
20160190007
Publication date
Jun 30, 2016
Su WANG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ADDITIVE C CAPABLE OF CHANGING MICROVIA-FILLING METHOD BY TSV COPPE...
Publication number
20160168737
Publication date
Jun 16, 2016
SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD.
Su WANG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Additive for Reducing Voids after Annealing of Copper Plating with...
Publication number
20160168738
Publication date
Jun 16, 2016
SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD.
Su WANG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR