XIAO-BIN WU

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Patents Grantslast 30 patents

Information Patent Grant
System and method for cutting substrate into workpieces
- Patent number 8,554,355
- Issue date Oct 8, 2013
- Hong Heng Sheng Electronical Technology (HuaiAn) Co., Ltd
- Xiao-Bin Wu
- B26 - HAND CUTTING TOOLS CUTTING SEVERING

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR CUTTING SUBSTRATE INTO WORKPIECES
- Publication number 20110230997
- Publication date Sep 22, 2011
- Hong Heng Sheng Electronical Technology (HuaiAn) Co.,LTd
- XIAO-BIN WU
- B26 - HAND CUTTING TOOLS CUTTING SEVERING