XIAO-CHUN WU

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor IC packaging methods and structures
- Patent number 9,589,815
- Issue date Mar 7, 2017
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR IC PACKAGING METHODS AND STRUCTURES
- Publication number 20140124927
- Publication date May 8, 2014
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- CHANG-MING LIN
- H01 - BASIC ELECTRIC ELEMENTS