Xiao Hu Liu

Person

Briarcliff Manor, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Forming ultra-thin chips for flexible electronics applications
- Patent number 11,295,982
- Issue date Apr 5, 2022
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancement of iso-via reliability
- Patent number 11,227,796
- Issue date Jan 18, 2022
- ELPIS TECHNOLOGIES INC.
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package structure having high density chip interconnect...
- Patent number 11,133,259
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronics for wearable healthcare sensors
- Patent number 11,015,913
- Issue date May 25, 2021
- International Business Machines Corporation
- Huan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectronic device with novel force amplification
- Patent number 10,964,881
- Issue date Mar 30, 2021
- International Business Machines Corporation
- Bruce G. Elmegreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced crack stop structure
- Patent number 10,957,657
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced crack stop structure
- Patent number 10,847,475
- Issue date Nov 24, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced crack stop structure
- Patent number 10,840,195
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced crack stop structure
- Patent number 10,840,194
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanofluidic channel fabrication by controlled spontaneous fracturing
- Patent number 10,622,220
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Xiao Hu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-scale power delivery
- Patent number 10,546,809
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Charles E. Cox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced crack stop structure
- Patent number 10,490,513
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced crack stop structure
- Patent number 10,475,753
- Issue date Nov 12, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancement of iso-via reliability
- Patent number 10,460,985
- Issue date Oct 29, 2019
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thru-silicon-via structures
- Patent number 10,388,567
- Issue date Aug 20, 2019
- GLOBALFOUNDRIES Inc.
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronics for wearable healthcare sensors
- Patent number 10,359,269
- Issue date Jul 23, 2019
- International Business Machines Corporation
- Huan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-scale power delivery
- Patent number 10,147,676
- Issue date Dec 4, 2018
- International Business Machines Corporation
- Charles E. Cox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectronic device with novel force amplification
- Patent number 9,941,472
- Issue date Apr 10, 2018
- International Business Machines Corporation
- Bruce G. Elmegreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thru-silicon-via structures
- Patent number 9,812,359
- Issue date Nov 7, 2017
- GLOBALFOUNDRIES Inc.
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancement of iso-via reliability
- Patent number 9,761,482
- Issue date Sep 12, 2017
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling fragmentation of chemically strengthened glass
- Patent number 9,738,560
- Issue date Aug 22, 2017
- International Business Machines Corporation
- Cyril Cabral
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Flexible electronics for wearable healthcare sensors
- Patent number 9,670,061
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Huan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Controlling fragmentation of chemically strengthened glass
- Patent number 9,586,857
- Issue date Mar 7, 2017
- International Business Machines Corporation
- Cyril Cabral
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Axiocentric scrubbing land grid array contacts and methods for fabr...
- Patent number 9,565,759
- Issue date Feb 7, 2017
- GLOBALFOUNDRIES Inc.
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure with air gap crack stop
- Patent number 9,536,842
- Issue date Jan 3, 2017
- GLOBALFOUNDRIES, INC.
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-vias for wiring layers of semiconductor devices
- Patent number 9,245,824
- Issue date Jan 26, 2016
- GLOBALFOUNDRIES Inc.
- Christopher V. Jahnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-vias for wiring layers of semicondutor devices
- Patent number 9,236,325
- Issue date Jan 12, 2016
- GLOBALFOUNDRIES Inc.
- Christopher V. Jahnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor article having a zig-zag guard ring and method of for...
- Patent number 9,082,781
- Issue date Jul 14, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Axiocentric scrubbing land grid array contacts and methods for fabr...
- Patent number 9,040,841
- Issue date May 26, 2015
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixed curvature force loading of mechanically spalled films
- Patent number 8,969,174
- Issue date Mar 3, 2015
- International Business Machines Corporation
- Stephen W. Bedell
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP PACKAGE STRUCTURE HAVING HIGH DENSITY CHIP INTERCONNECT...
- Publication number 20210183773
- Publication date Jun 17, 2021
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING ULTRA-THIN CHIPS FOR FLEXIBLE ELECTRONICS APPLICATIONS
- Publication number 20200395248
- Publication date Dec 17, 2020
- International Business Machines Corporation
- KATSUYUKI Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED CRACK STOP STRUCTURE
- Publication number 20200118943
- Publication date Apr 16, 2020
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED CRACK STOP STRUCTURE
- Publication number 20200051930
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED CRACK STOP STRUCTURE
- Publication number 20200035620
- Publication date Jan 30, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED CRACK STOP STRUCTURE
- Publication number 20200035621
- Publication date Jan 30, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCEMENT OF ISO-VIA RELIABILITY
- Publication number 20200013671
- Publication date Jan 9, 2020
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED CRACK STOP STRUCTURE
- Publication number 20190304928
- Publication date Oct 3, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED CRACK STOP STRUCTURE
- Publication number 20190304929
- Publication date Oct 3, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONICS FOR WEARABLE HEALTHCARE SENSORS
- Publication number 20190242690
- Publication date Aug 8, 2019
- International Business Machines Corporation
- HUAN HU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-SCALE POWER DELIVERY
- Publication number 20190035722
- Publication date Jan 31, 2019
- International Business Machines Corporation
- Charles E. Cox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-SCALE POWER DELIVERY
- Publication number 20180331028
- Publication date Nov 15, 2018
- International Business Machines Corporation
- Charles E. Cox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOELECTRONIC DEVICE WITH NOVEL FORCE AMPLIFICATION
- Publication number 20180090681
- Publication date Mar 29, 2018
- International Business Machines Corporation
- Bruce G. Elmegreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONICS FOR WEARABLE HEALTHCARE SENSORS
- Publication number 20180073854
- Publication date Mar 15, 2018
- International Business Machines Corporation
- HUAN HU
- G01 - MEASURING TESTING
Information Patent Application
THRU-SILICON-VIA STRUCTURES
- Publication number 20180047626
- Publication date Feb 15, 2018
- GLOBALFOUNDRIES INC.
- Fen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCEMENT OF ISO-VIA RELIABILITY
- Publication number 20170316970
- Publication date Nov 2, 2017
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THRU-SILICON-VIA STRUCTURES
- Publication number 20160358821
- Publication date Dec 8, 2016
- International Business Machines Corporation
- Fen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING FRAGMENTATION OF CHEMICALLY STRENGTHENED GLASS
- Publication number 20160264456
- Publication date Sep 15, 2016
- International Business Machines Corporation
- Cyril Cabral
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
System and Method for a Generic Single Sign-On Function
- Publication number 20160255075
- Publication date Sep 1, 2016
- Samsung Electronics Co., Ltd.
- Haiqing Jiang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DISCONTINUOUS AIR GAP CRACK STOP
- Publication number 20160181208
- Publication date Jun 23, 2016
- GLOBALFOUNDRIES INC.
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING FRAGMENTATION OF CHEMICALLY STRENGTHENED GLASS
- Publication number 20160137548
- Publication date May 19, 2016
- International Business Machines Corporation
- Cyril Cabral
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
ENHANCEMENT OF ISO-VIA RELIABILITY
- Publication number 20150364365
- Publication date Dec 17, 2015
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABR...
- Publication number 20150334830
- Publication date Nov 19, 2015
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCEMENT OF ISO-VIA RELIABILITY
- Publication number 20150255388
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOELECTRONIC DEVICE WITH NOVEL FORCE AMPLIFICATION
- Publication number 20150255699
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Bruce G. Elmegreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARTICLE HAVING A ZIG-ZAG GUARD RING
- Publication number 20150097297
- Publication date Apr 9, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-VIAS FOR WIRING LAYERS OF SEMICONDUCTOR DEVICES
- Publication number 20140312467
- Publication date Oct 23, 2014
- International Business Machines Corporation
- Christopher V. Jahnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-VIAS FOR WIRING LAYERS OF SEMICONDUCTOR DEVICES
- Publication number 20140312502
- Publication date Oct 23, 2014
- International Business Machines Corporation
- Christopher V. Jahnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELETRIC CAP HAVING MATERIAL WITH OPTICAL BAND GAP TO SUBSTANTIALL...
- Publication number 20140302685
- Publication date Oct 9, 2014
- Michael P. Belyansky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thick On-Chip High-Performance Wiring Structures
- Publication number 20140167219
- Publication date Jun 19, 2014
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS

Xiao Hu Liu

Person

Patents Grantslast 30 patents

Forming ultra-thin chips for flexible electronics applications

Enhancement of iso-via reliability

Multi-chip package structure having high density chip interconnect...

Flexible electronics for wearable healthcare sensors

Piezoelectronic device with novel force amplification

Advanced crack stop structure

Advanced crack stop structure

Advanced crack stop structure

Advanced crack stop structure

Nanofluidic channel fabrication by controlled spontaneous fracturing

Wafer-scale power delivery

Advanced crack stop structure

Advanced crack stop structure

Enhancement of iso-via reliability

Thru-silicon-via structures

Flexible electronics for wearable healthcare sensors

Wafer-scale power delivery

Piezoelectronic device with novel force amplification

Thru-silicon-via structures

Enhancement of iso-via reliability

Controlling fragmentation of chemically strengthened glass

Flexible electronics for wearable healthcare sensors

Controlling fragmentation of chemically strengthened glass

Axiocentric scrubbing land grid array contacts and methods for fabr...

Structure with air gap crack stop

Through-vias for wiring layers of semiconductor devices

Through-vias for wiring layers of semicondutor devices

Semiconductor article having a zig-zag guard ring and method of for...

Axiocentric scrubbing land grid array contacts and methods for fabr...

Fixed curvature force loading of mechanically spalled films

Patents Applicationslast 30 patents

MULTI-CHIP PACKAGE STRUCTURE HAVING HIGH DENSITY CHIP INTERCONNECT...

FORMING ULTRA-THIN CHIPS FOR FLEXIBLE ELECTRONICS APPLICATIONS

ADVANCED CRACK STOP STRUCTURE

ADVANCED CRACK STOP STRUCTURE

ADVANCED CRACK STOP STRUCTURE

ADVANCED CRACK STOP STRUCTURE

ENHANCEMENT OF ISO-VIA RELIABILITY

ADVANCED CRACK STOP STRUCTURE

ADVANCED CRACK STOP STRUCTURE

FLEXIBLE ELECTRONICS FOR WEARABLE HEALTHCARE SENSORS

WAFER-SCALE POWER DELIVERY

WAFER-SCALE POWER DELIVERY

PIEZOELECTRONIC DEVICE WITH NOVEL FORCE AMPLIFICATION

FLEXIBLE ELECTRONICS FOR WEARABLE HEALTHCARE SENSORS

THRU-SILICON-VIA STRUCTURES

ENHANCEMENT OF ISO-VIA RELIABILITY

THRU-SILICON-VIA STRUCTURES

CONTROLLING FRAGMENTATION OF CHEMICALLY STRENGTHENED GLASS

System and Method for a Generic Single Sign-On Function

DISCONTINUOUS AIR GAP CRACK STOP

CONTROLLING FRAGMENTATION OF CHEMICALLY STRENGTHENED GLASS

ENHANCEMENT OF ISO-VIA RELIABILITY

AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABR...

ENHANCEMENT OF ISO-VIA RELIABILITY

PIEZOELECTRONIC DEVICE WITH NOVEL FORCE AMPLIFICATION

SEMICONDUCTOR ARTICLE HAVING A ZIG-ZAG GUARD RING

THROUGH-VIAS FOR WIRING LAYERS OF SEMICONDUCTOR DEVICES

THROUGH-VIAS FOR WIRING LAYERS OF SEMICONDUCTOR DEVICES

DIELETRIC CAP HAVING MATERIAL WITH OPTICAL BAND GAP TO SUBSTANTIALL...

Thick On-Chip High-Performance Wiring Structures