Xiao Lu

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Varied ball ball-grid-array (BGA) packages
- Patent number 11,916,003
- Issue date Feb 27, 2024
- Intel Corporation
- Xiao Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of assembling an electronic component using a probe having a...
- Patent number 10,278,318
- Issue date Apr 30, 2019
- Intel Corporation
- Kyle Yazzie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED ANTIOXIDANT AND SEALANT SOLUTION TO ADDRESS TEMPERATURE...
- Publication number 20240304506
- Publication date Sep 12, 2024
- Intel Corporation
- Sangeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
- Publication number 20240162134
- Publication date May 16, 2024
- Intel Corporation
- Xiao LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL (LM) DISPENSING APPARATUS AND METHODS FOR DESIGN AND O...
- Publication number 20230415253
- Publication date Dec 28, 2023
- Intel Corporation
- Sangeon Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT INJECTION FILLING DEVICE, SYSTEM, AND METHOD FOR LIQUID META...
- Publication number 20230317476
- Publication date Oct 5, 2023
- Intel Corporation
- Sangeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDD...
- Publication number 20230317619
- Publication date Oct 5, 2023
- Intel Corporation
- Ravindranath V. Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPING FOR LIQUID METAL SOCKET INTERCONNECTS
- Publication number 20230299024
- Publication date Sep 21, 2023
- Intel Corporation
- Jiaqi Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER GRID ARRAY FOR ATTACHMENT OF A DIE PACKAGE
- Publication number 20230197659
- Publication date Jun 22, 2023
- Intel Corporation
- Mukund Ayalasomayajula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
- Publication number 20210082798
- Publication date Mar 18, 2021
- Intel Corporation
- Xiao LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE ASSEMBLY WITH SPACER ELEMENT
- Publication number 20190206821
- Publication date Jul 4, 2019
- Intel Corporation
- Huxiao XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH COMPONENT PLACEMENT TEMPLATE
- Publication number 20170290211
- Publication date Oct 5, 2017
- Intel Corporation
- DANIEL CHAVEZ-CLEMENTE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY PROBE UTLIZING A FLUID TO ASSEMBLE COMPONENTS AND SYSTEMS...
- Publication number 20170181339
- Publication date Jun 22, 2017
- Intel Corporation
- Kyle Yazzie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Varied ball ball-grid-array (BGA) packages

Method of assembling an electronic component using a probe having a...

Patents Applicationslast 30 patents

INTEGRATED ANTIOXIDANT AND SEALANT SOLUTION TO ADDRESS TEMPERATURE...

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

LIQUID METAL (LM) DISPENSING APPARATUS AND METHODS FOR DESIGN AND O...

DIRECT INJECTION FILLING DEVICE, SYSTEM, AND METHOD FOR LIQUID META...

MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDD...

BUMPING FOR LIQUID METAL SOCKET INTERCONNECTS

SOLDER GRID ARRAY FOR ATTACHMENT OF A DIE PACKAGE

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

SUBSTRATE ASSEMBLY WITH SPACER ELEMENT

BATCH COMPONENT PLACEMENT TEMPLATE

ASSEMBLY PROBE UTLIZING A FLUID TO ASSEMBLE COMPONENTS AND SYSTEMS...