Xiaobo Shi

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low dishing oxide CMP polishing compositions for shallow trench iso...
- Patent number 12,234,383
- Issue date Feb 25, 2025
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High oxide film removal rate shallow trench (STI) chemical mechanic...
- Patent number 12,091,581
- Issue date Sep 17, 2024
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chemical mechanical planarization composition for polishing oxide m...
- Patent number 11,718,767
- Issue date Aug 8, 2023
- VERSUM MATERIALS US, LLC
- Ming-Shih Tsai
- B24 - GRINDING POLISHING
Information Patent Grant
Low oxide trench dishing chemical mechanical polishing
- Patent number 11,692,110
- Issue date Jul 4, 2023
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low oxide trench dishing chemical mechanical polishing
- Patent number 11,667,839
- Issue date Jun 6, 2023
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten chemical mechanical polishing for reduced oxide erosion
- Patent number 11,643,599
- Issue date May 9, 2023
- VERSUM MATERIALS US, LLC
- Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shallow trench isolation (STI) chemical mechanical planarization (C...
- Patent number 11,608,451
- Issue date Mar 21, 2023
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Oxide chemical mechanical planarization (CMP) polishing compositions
- Patent number 11,549,034
- Issue date Jan 10, 2023
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chemical mechanical planarization (CMP) composition and methods the...
- Patent number 11,401,441
- Issue date Aug 2, 2022
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shallow trench isolation (STI) chemical mechanical planarization (C...
- Patent number 11,326,076
- Issue date May 10, 2022
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low oxide trench dishing shallow trench isolation chemical mechanic...
- Patent number 11,254,839
- Issue date Feb 22, 2022
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suppressing SiN removal rates and reducing oxide trench dishing for...
- Patent number 11,180,678
- Issue date Nov 23, 2021
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal compound chemically anchored colloidal particles and methods...
- Patent number 11,104,825
- Issue date Aug 31, 2021
- VERSUM MATERIALS US, LLC
- Hongjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low oxide trench dishing chemical mechanical polishing
- Patent number 11,078,417
- Issue date Aug 3, 2021
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low oxide trench dishing chemical mechanical polishing
- Patent number 11,072,726
- Issue date Jul 27, 2021
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical planarization for tungsten-containing substrates
- Patent number 11,066,575
- Issue date Jul 20, 2021
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal chemical mechanical planarization (CMP) composition and metho...
- Patent number 10,920,106
- Issue date Feb 16, 2021
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chemical mechanical polishing (CMP) of cobalt-containing substrate
- Patent number 10,745,589
- Issue date Aug 18, 2020
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composite abrasive particles for chemical mechanical planarization...
- Patent number 10,669,449
- Issue date Jun 2, 2020
- VERSUM MATERIALS US, LLC
- Hongjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dishing reducing in tungsten chemical mechanical polishing
- Patent number 10,570,313
- Issue date Feb 25, 2020
- VERSUM MATERIALS US, LLC
- Matthias Stender
- B24 - GRINDING POLISHING
Information Patent Grant
Metal chemical mechanical planarization (CMP) composition and metho...
- Patent number 10,465,096
- Issue date Nov 5, 2019
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Additives for barrier chemical mechanical planarization
- Patent number 10,253,216
- Issue date Apr 9, 2019
- VERSUM MATERIALS US, LLC
- Matthias Stender
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing (CMP) of cobalt-containing substrate
- Patent number 10,217,645
- Issue date Feb 26, 2019
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal compound chemically anchored colloidal particles and methods...
- Patent number 10,160,884
- Issue date Dec 25, 2018
- VERSUM MATERIALS US, LLC
- Hongjun Zhou
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Composite abrasive particles for chemical mechanical planarization...
- Patent number 10,109,493
- Issue date Oct 23, 2018
- VERSUM MATERIALS US, LLC
- Hongjun Zhou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Barrier chemical mechanical planarization slurries using ceria-coat...
- Patent number 10,032,644
- Issue date Jul 24, 2018
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing (CMP) composition for shallow trench...
- Patent number 10,011,741
- Issue date Jul 3, 2018
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- B24 - GRINDING POLISHING
Information Patent Grant
Low dishing copper chemical mechanical planarization
- Patent number 9,978,609
- Issue date May 22, 2018
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- B24 - GRINDING POLISHING
Information Patent Grant
Barrier chemical mechanical planarization composition and method th...
- Patent number 9,574,110
- Issue date Feb 21, 2017
- Air Products and Chemicals, Inc.
- Maitland Gary Graham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing (CMP) composition for shallow trench...
- Patent number 9,305,476
- Issue date Apr 5, 2016
- Air Products and Chemicals, Inc.
- Xiaobo Shi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION...
- Publication number 20250014911
- Publication date Jan 9, 2025
- VERSUM MATERIALS US, LLC
- XIAOBO SHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PAD-IN-A-BOTTLE CHEMICAL MECHANICAL PLANARIZATION POLISHING WITH CO...
- Publication number 20240425723
- Publication date Dec 26, 2024
- VERSUM MATERIALS US, LLC
- XIAOBO SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Triazole- And/Or Triazolium-Based Polymers And Copolymers As Additi...
- Publication number 20240400861
- Publication date Dec 5, 2024
- VERSUM MATERIALS US, LLC
- Gregor Larbig
- B24 - GRINDING POLISHING
Information Patent Application
Chemical Mechanical Planarization Polishing For Shallow Trench Isol...
- Publication number 20240395558
- Publication date Nov 28, 2024
- VERSUM MATERIALS US, LLC
- Hongjun Zhou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER BARRIER SLURRIES
- Publication number 20240352279
- Publication date Oct 24, 2024
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Oxide Removal Rates Shallow Trench Isolation Chemical Mechanic...
- Publication number 20240297049
- Publication date Sep 5, 2024
- VERSUM MATERIALS US, LLC
- Joseph D. Rose
- B24 - GRINDING POLISHING
Information Patent Application
Phosphonium Based Polymers And Copolymers As Additives For Chemical...
- Publication number 20240261931
- Publication date Aug 8, 2024
- VERSUM MATERIALS US, LLC
- GREGOR LARBIG
- B24 - GRINDING POLISHING
Information Patent Application
IMIDAZOLIUM-BASED POLY(IONIC LIQUID)S AND USE THEREFORE
- Publication number 20240247090
- Publication date Jul 25, 2024
- VERSUM MATERIALS US, LLC
- Gregor Larbig
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Chemical Mechanical Planarization (CMP) For Copper And Through-Sili...
- Publication number 20240006189
- Publication date Jan 4, 2024
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER AND THROUGH-SILICON VIA...
- Publication number 20230287242
- Publication date Sep 14, 2023
- VERSUM MATERIALS US, LLC
- XIAOBO SHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Low Dishing Oxide CMP Polishing Compositions For Shallow Trench Iso...
- Publication number 20230193079
- Publication date Jun 22, 2023
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
High Oxide Film Removal Rate Shallow Trench (STI) Chemical Mechanic...
- Publication number 20230020073
- Publication date Jan 19, 2023
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- B24 - GRINDING POLISHING
Information Patent Application
Low Dishing Copper Chemical Mechanical Planarization
- Publication number 20220332978
- Publication date Oct 20, 2022
- VERSUM MATERIALS US, LLC
- KEH-YEUAN LI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Selective Chemical Mechanical Planarization Polishing
- Publication number 20220195245
- Publication date Jun 23, 2022
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Low Oxide Trench Dishing Chemical Mechanical Polishing
- Publication number 20210324270
- Publication date Oct 21, 2021
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Low Oxide Trench Dishing Chemical Mechanical Polishing
- Publication number 20210309885
- Publication date Oct 7, 2021
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Chemical Mechanical Planarization Slurries For Cobalt Films
- Publication number 20210301405
- Publication date Sep 30, 2021
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Low Oxide Trench Dishing Shallow Trench Isolation Chemical Mechanic...
- Publication number 20210179890
- Publication date Jun 17, 2021
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Chemical Mechanical Polishing For Copper And Through Silicon Via Ap...
- Publication number 20200277514
- Publication date Sep 3, 2020
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shallow Trench Isolation (STI) Chemical Mechanical Planarization (C...
- Publication number 20200239736
- Publication date Jul 30, 2020
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shallow Trench Isolation (STI) Chemical Mechanical Planarization (C...
- Publication number 20200239735
- Publication date Jul 30, 2020
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Suppressing SiN Removal Rates And Reducing Oxide Trench Dishing For...
- Publication number 20200131404
- Publication date Apr 30, 2020
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- B24 - GRINDING POLISHING
Information Patent Application
Composite Abrasive Particles for Chemical Mechanical Planarization...
- Publication number 20200115590
- Publication date Apr 16, 2020
- VERSUM MATERIALS US, LLC
- Hongjun Zhou
- B24 - GRINDING POLISHING
Information Patent Application
High Oxide VS Nitride Selectivity, Low And Uniform Oxide Trench Dis...
- Publication number 20200095502
- Publication date Mar 26, 2020
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Chemical Mechanical Planarization For Tungsten-Containing Substrates
- Publication number 20200079976
- Publication date Mar 12, 2020
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Oxide Chemical Mechanical Planarization (CMP) Polishing Compositions
- Publication number 20200048496
- Publication date Feb 13, 2020
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Chemical Mechanical Planarization Composition For Polishing Oxide M...
- Publication number 20200048551
- Publication date Feb 13, 2020
- VERSUM MATERIALS US, LLC
- Ming-Shih Tsai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Metal Chemical Mechanical Planarization (CMP) Composition And Metho...
- Publication number 20200032107
- Publication date Jan 30, 2020
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Tungsten Chemical Mechanical Polishing For Reduced Oxide Erosion
- Publication number 20200024515
- Publication date Jan 23, 2020
- VERSUM MATERIALS US, LLC
- Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Oxide Trench Dishing Chemical Mechanical Polishing
- Publication number 20200002607
- Publication date Jan 2, 2020
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Person

Patents Grantslast 30 patents

Low dishing oxide CMP polishing compositions for shallow trench iso...

High oxide film removal rate shallow trench (STI) chemical mechanic...

Chemical mechanical planarization composition for polishing oxide m...

Low oxide trench dishing chemical mechanical polishing

Low oxide trench dishing chemical mechanical polishing

Tungsten chemical mechanical polishing for reduced oxide erosion

Shallow trench isolation (STI) chemical mechanical planarization (C...

Oxide chemical mechanical planarization (CMP) polishing compositions

Chemical mechanical planarization (CMP) composition and methods the...

Shallow trench isolation (STI) chemical mechanical planarization (C...

Low oxide trench dishing shallow trench isolation chemical mechanic...

Suppressing SiN removal rates and reducing oxide trench dishing for...

Metal compound chemically anchored colloidal particles and methods...

Low oxide trench dishing chemical mechanical polishing

Low oxide trench dishing chemical mechanical polishing

Chemical mechanical planarization for tungsten-containing substrates

Metal chemical mechanical planarization (CMP) composition and metho...

Chemical mechanical polishing (CMP) of cobalt-containing substrate

Composite abrasive particles for chemical mechanical planarization...

Dishing reducing in tungsten chemical mechanical polishing

Metal chemical mechanical planarization (CMP) composition and metho...

Additives for barrier chemical mechanical planarization

Chemical mechanical polishing (CMP) of cobalt-containing substrate

Metal compound chemically anchored colloidal particles and methods...

Composite abrasive particles for chemical mechanical planarization...

Barrier chemical mechanical planarization slurries using ceria-coat...

Chemical mechanical polishing (CMP) composition for shallow trench...

Low dishing copper chemical mechanical planarization

Barrier chemical mechanical planarization composition and method th...

Chemical mechanical polishing (CMP) composition for shallow trench...

Patents Applicationslast 30 patents

PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION...

PAD-IN-A-BOTTLE CHEMICAL MECHANICAL PLANARIZATION POLISHING WITH CO...

Triazole- And/Or Triazolium-Based Polymers And Copolymers As Additi...

Chemical Mechanical Planarization Polishing For Shallow Trench Isol...

PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER BARRIER SLURRIES

High Oxide Removal Rates Shallow Trench Isolation Chemical Mechanic...

Phosphonium Based Polymers And Copolymers As Additives For Chemical...

IMIDAZOLIUM-BASED POLY(IONIC LIQUID)S AND USE THEREFORE

Chemical Mechanical Planarization (CMP) For Copper And Through-Sili...

PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER AND THROUGH-SILICON VIA...

Low Dishing Oxide CMP Polishing Compositions For Shallow Trench Iso...

High Oxide Film Removal Rate Shallow Trench (STI) Chemical Mechanic...

Low Dishing Copper Chemical Mechanical Planarization

Selective Chemical Mechanical Planarization Polishing

Low Oxide Trench Dishing Chemical Mechanical Polishing

Low Oxide Trench Dishing Chemical Mechanical Polishing

Barrier Chemical Mechanical Planarization Slurries For Cobalt Films

Low Oxide Trench Dishing Shallow Trench Isolation Chemical Mechanic...

Chemical Mechanical Polishing For Copper And Through Silicon Via Ap...

Shallow Trench Isolation (STI) Chemical Mechanical Planarization (C...

Shallow Trench Isolation (STI) Chemical Mechanical Planarization (C...

Suppressing SiN Removal Rates And Reducing Oxide Trench Dishing For...

Composite Abrasive Particles for Chemical Mechanical Planarization...

High Oxide VS Nitride Selectivity, Low And Uniform Oxide Trench Dis...

Chemical Mechanical Planarization For Tungsten-Containing Substrates

Oxide Chemical Mechanical Planarization (CMP) Polishing Compositions

Chemical Mechanical Planarization Composition For Polishing Oxide M...

Metal Chemical Mechanical Planarization (CMP) Composition And Metho...

Tungsten Chemical Mechanical Polishing For Reduced Oxide Erosion

Low Oxide Trench Dishing Chemical Mechanical Polishing