Xiaochun Tan

Person

Hangzhou, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked package structure and stacked packaging method for chip
- Patent number 11,462,510
- Issue date Oct 4, 2022
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package structure and stacked packaging method for chip
- Patent number 10,763,241
- Issue date Sep 1, 2020
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated package assembly for switching regulator
- Patent number 10,741,481
- Issue date Aug 11, 2020
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method thereof
- Patent number 10,734,249
- Issue date Aug 4, 2020
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method therof
- Patent number 10,319,608
- Issue date Jun 11, 2019
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly having interconnect for stacked electronic devices...
- Patent number 10,128,221
- Issue date Nov 13, 2018
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated package assembly for switching regulator
- Patent number 10,043,738
- Issue date Aug 7, 2018
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package method for reducing chip leakage current
- Patent number 9,786,521
- Issue date Oct 10, 2017
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method therefor
- Patent number 9,780,081
- Issue date Oct 3, 2017
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package structure and fabrication process thereof
- Patent number 9,735,122
- Issue date Aug 15, 2017
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly and method for manufacturing the same
- Patent number 9,699,918
- Issue date Jul 4, 2017
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package structure and fabrication process thereof
- Patent number 9,653,355
- Issue date May 16, 2017
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package method and package assembly
- Patent number 9,595,453
- Issue date Mar 14, 2017
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, manufacture method and package structure thereof
- Patent number 9,373,567
- Issue date Jun 21, 2016
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level package assembly having conductive vias coupled to chip...
- Patent number 9,324,633
- Issue date Apr 26, 2016
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package structure and method for an integrated switching...
- Patent number 9,245,872
- Issue date Jan 26, 2016
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip packaging structure of a plurality of assemblies
- Patent number 9,136,207
- Issue date Sep 15, 2015
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip stacked package and method for forming the same
- Patent number 9,136,248
- Issue date Sep 15, 2015
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging structure and method
- Patent number 9,129,947
- Issue date Sep 8, 2015
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,123,629
- Issue date Sep 1, 2015
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package structure and method for an integrated switching...
- Patent number 9,024,440
- Issue date May 5, 2015
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package structure and method of making the same
- Patent number 8,866,283
- Issue date Oct 21, 2014
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor package structure thereof
- Patent number 8,866,273
- Issue date Oct 21, 2014
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and flip packaging device thereof
- Patent number 8,853,838
- Issue date Oct 7, 2014
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and flip chip package device thereof
- Patent number 8,836,093
- Issue date Sep 16, 2014
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STACKED PACKAGE STRUCTURE AND STACKED PACKAGING METHOD FOR CHIP
- Publication number 20220415856
- Publication date Dec 29, 2022
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE STRUCTURE AND STACKED PACKAGING METHOD FOR CHIP
- Publication number 20200328191
- Publication date Oct 15, 2020
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD THEREOF
- Publication number 20190198351
- Publication date Jun 27, 2019
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE ASSEMBLY FOR SWITCHING REGULATOR
- Publication number 20180277470
- Publication date Sep 27, 2018
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF
- Publication number 20170179057
- Publication date Jun 22, 2017
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE METHOD AND CHIP PACKAGE STRUCTURE
- Publication number 20170154793
- Publication date Jun 1, 2017
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE STRUCTURE AND STACKED PACKAGING METHOD FOR CHIP
- Publication number 20170110441
- Publication date Apr 20, 2017
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD THEREOF
- Publication number 20160372432
- Publication date Dec 22, 2016
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE METHOD AND PACKAGE ASSEMBLY
- Publication number 20160365257
- Publication date Dec 15, 2016
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20160284638
- Publication date Sep 29, 2016
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160113144
- Publication date Apr 21, 2016
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150214200
- Publication date Jul 30, 2015
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE ASSEMBLY FOR SWITCHING REGULATOR
- Publication number 20150214141
- Publication date Jul 30, 2015
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGE STRUCTURE AND METHOD FOR AN INTEGRATED SWITCHING...
- Publication number 20150206857
- Publication date Jul 23, 2015
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150187738
- Publication date Jul 2, 2015
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150171064
- Publication date Jun 18, 2015
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20150115439
- Publication date Apr 30, 2015
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP STACKED PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20150115425
- Publication date Apr 30, 2015
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, MANUFACTURE METHOD AND PACKAGE STRUCTURE THEREOF
- Publication number 20150048491
- Publication date Feb 19, 2015
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF
- Publication number 20140167256
- Publication date Jun 19, 2014
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE OF A PLURALITY OF ASSEMBLIES
- Publication number 20140159218
- Publication date Jun 12, 2014
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT CHIP PACKAGING STRUCTURE
- Publication number 20140159219
- Publication date Jun 12, 2014
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGING METHOD
- Publication number 20140120661
- Publication date May 1, 2014
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND FLIP PACKAGING DEVICE THEREOF
- Publication number 20140117520
- Publication date May 1, 2014
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP PACKAGING DEVICE
- Publication number 20140097542
- Publication date Apr 10, 2014
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGE STRUCTURE AND METHOD FOR AN INTEGRATED SWITCHING...
- Publication number 20140070385
- Publication date Mar 13, 2014
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MULTI-CHIP PACKAGING STRUCTURE AND METHOD
- Publication number 20140070390
- Publication date Mar 13, 2014
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR PACKAGE STRUCTURE THEREOF
- Publication number 20130134567
- Publication date May 30, 2013
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND FLIP CHIP PACKAGE DEVICE THEREOF
- Publication number 20130134568
- Publication date May 30, 2013
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS

Xiaochun Tan

Person

Patents Grantslast 30 patents

Stacked package structure and stacked packaging method for chip

Stacked package structure and stacked packaging method for chip

Integrated package assembly for switching regulator

Package structure and method thereof

Package structure and method therof

Package assembly having interconnect for stacked electronic devices...

Integrated package assembly for switching regulator

Chip package method for reducing chip leakage current

Chip package structure and manufacturing method therefor

Flip chip package structure and fabrication process thereof

Package assembly and method for manufacturing the same

Flip chip package structure and fabrication process thereof

Chip package method and package assembly

Lead frame, manufacture method and package structure thereof

Multi-level package assembly having conductive vias coupled to chip...

Flip-chip package structure and method for an integrated switching...

Chip packaging structure of a plurality of assemblies

Multi-chip stacked package and method for forming the same

Multi-chip packaging structure and method

Chip package and method for forming the same

Flip-chip package structure and method for an integrated switching...

Chip package structure and method of making the same

Lead frame and semiconductor package structure thereof

Lead frame and flip packaging device thereof

Lead frame and flip chip package device thereof

Patents Applicationslast 30 patents

STACKED PACKAGE STRUCTURE AND STACKED PACKAGING METHOD FOR CHIP

STACKED PACKAGE STRUCTURE AND STACKED PACKAGING METHOD FOR CHIP

PACKAGE STRUCTURE AND METHOD THEREOF

INTEGRATED PACKAGE ASSEMBLY FOR SWITCHING REGULATOR

FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF

CHIP PACKAGE METHOD AND CHIP PACKAGE STRUCTURE

STACKED PACKAGE STRUCTURE AND STACKED PACKAGING METHOD FOR CHIP

PACKAGE STRUCTURE AND METHOD THEREOF

CHIP PACKAGE METHOD AND PACKAGE ASSEMBLY

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED PACKAGE ASSEMBLY FOR SWITCHING REGULATOR

FLIP-CHIP PACKAGE STRUCTURE AND METHOD FOR AN INTEGRATED SWITCHING...

PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

MULTI-CHIP STACKED PACKAGE AND METHOD FOR FORMING THE SAME

LEAD FRAME, MANUFACTURE METHOD AND PACKAGE STRUCTURE THEREOF

FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF

CHIP PACKAGING STRUCTURE OF A PLURALITY OF ASSEMBLIES

MULTI-COMPONENT CHIP PACKAGING STRUCTURE

FLIP CHIP PACKAGING METHOD

LEAD FRAME AND FLIP PACKAGING DEVICE THEREOF

FLIP PACKAGING DEVICE

FLIP-CHIP PACKAGE STRUCTURE AND METHOD FOR AN INTEGRATED SWITCHING...

MULTI-CHIP PACKAGING STRUCTURE AND METHOD

LEAD FRAME AND SEMICONDUCTOR PACKAGE STRUCTURE THEREOF

LEAD FRAME AND FLIP CHIP PACKAGE DEVICE THEREOF