Xiaodong LI

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Patents Grantslast 30 patents

Information Patent Grant
Contact pad structures and methods for fabricating contact pad stru...
- Patent number 11,646,279
- Issue date May 9, 2023
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xiaodong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad reliability of semiconductor devices
- Patent number 10,658,316
- Issue date May 19, 2020
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xiaodong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for reducing contamination for reliable bond pads
- Patent number 10,410,854
- Issue date Sep 10, 2019
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Honghui Mou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTACT PAD STRUCTURES AND METHODS FOR FABRICATING CONTACT PAD STRU...
- Publication number 20220270991
- Publication date Aug 25, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- XIAODONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD RELIABILITY OF SEMICONDUCTOR DEVICES
- Publication number 20200105690
- Publication date Apr 2, 2020
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- XIAODONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR REDUCING CONTAMINATION FOR RELIABLE BOND PADS
- Publication number 20190206676
- Publication date Jul 4, 2019
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Honghui MOU
- H01 - BASIC ELECTRIC ELEMENTS