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last 30 patents
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Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND MANUFACTURING METHOD
Publication number
20240014188
Publication date
Jan 11, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC
Xiaofei SUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD
Publication number
20240014189
Publication date
Jan 11, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC
Xiaofei SUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD
Publication number
20240014196
Publication date
Jan 11, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC
Xiaofei SUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND MANUFACTURING METHOD
Publication number
20230014357
Publication date
Jan 19, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Xiaofei SUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230014834
Publication date
Jan 19, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Xiaofei SUN
H01 - BASIC ELECTRIC ELEMENTS