Xiaofeng Xu

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Heat-dissipating semiconductor package including a plurality of met...
- Patent number 11,133,235
- Issue date Sep 28, 2021
- DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
- Jie Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 10,910,303
- Issue date Feb 2, 2021
- DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
- Xiaofeng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging semiconductor device
- Patent number 9,735,114
- Issue date Aug 15, 2017
- DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
- Xiaofeng Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20200373213
- Publication date Nov 26, 2020
- Delta Electronics Int'l (Singapore) Pte Ltd
- Jie Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200203268
- Publication date Jun 25, 2020
- Delta Electronics Int'l (Singapore) Pte Ltd
- Xiaofeng Xu
- H01 - BASIC ELECTRIC ELEMENTS