Xiaoguang Zeng

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having mold locking feature
- Patent number 12,142,548
- Issue date Nov 12, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded intelligent power module for motors
- Patent number 10,600,727
- Issue date Mar 24, 2020
- Alpha and Omega Semiconductor (Cayman) LTD
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical-enhanced package singulation process
- Patent number 7,553,700
- Issue date Jun 30, 2009
- GEM Services, Inc.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package diepad having features formed by elect...
- Patent number 7,382,044
- Issue date Jun 3, 2008
- GEM Services, Inc.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package diepad having features formed by elect...
- Patent number 7,122,406
- Issue date Oct 17, 2006
- GEM Services, Inc.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MOLD LOCKING FEATURE
- Publication number 20230215783
- Publication date Jul 6, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTELLIGENT POWER MODULE FOR MOTORS
- Publication number 20190006270
- Publication date Jan 3, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SEMICONDUCTOR DEVICE
- Publication number 20150206868
- Publication date Jul 23, 2015
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SEMICONDUCTOR DEVICE
- Publication number 20120248539
- Publication date Oct 4, 2012
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY ELECTROPLATING
- Publication number 20110003439
- Publication date Jan 6, 2011
- GEM Services
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package diepad having features formed by elect...
- Publication number 20080142936
- Publication date Jun 19, 2008
- GEM Services, Inc.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical-enhanced package singulation process
- Publication number 20050255634
- Publication date Nov 17, 2005
- GEM Services, Inc.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS

Xiaoguang Zeng

Person

Patents Grantslast 30 patents

Semiconductor package having mold locking feature

Molded intelligent power module for motors

Chemical-enhanced package singulation process

Semiconductor device package diepad having features formed by elect...

Semiconductor device package diepad having features formed by elect...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING MOLD LOCKING FEATURE

MOLDED INTELLIGENT POWER MODULE FOR MOTORS

FLIP CHIP SEMICONDUCTOR DEVICE

FLIP CHIP SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY ELECTROPLATING

Semiconductor device package diepad having features formed by elect...

Chemical-enhanced package singulation process