Xiaohua ZHAN

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuits having copper bonding structures with silicon c...
- Patent number 9,859,236
- Issue date Jan 2, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Meng Meng Chong
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUITS HAVING COPPER BONDING STRUCTURES WITH SILICON C...
- Publication number 20170040272
- Publication date Feb 9, 2017
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Meng Meng Chong
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PAD SOLUTIONS FOR RELIABLE BONDS
- Publication number 20150061156
- Publication date Mar 5, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Yi JIANG
- H01 - BASIC ELECTRIC ELEMENTS