Xiaojie Xue

Person

Bedford, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cavity package with composite substrate
- Patent number 10,490,510
- Issue date Nov 26, 2019
- Analog Devices, Inc.
- Xiaojie Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress isolation features for stacked dies
- Patent number 10,287,161
- Issue date May 14, 2019
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cavity package with composite substrate
- Patent number 9,728,510
- Issue date Aug 8, 2017
- Analog Devices, Inc.
- Xiaojie Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device die and package with stress reduction features
- Patent number 9,698,127
- Issue date Jul 4, 2017
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated device die and package with stress reduction features
- Patent number 9,343,367
- Issue date May 17, 2016
- Analog Devices, Inc.
- Thomas M. Goida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical mount package and wafer level packaging therefor
- Patent number 9,278,851
- Issue date Mar 8, 2016
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Double-sided package
- Patent number 9,209,121
- Issue date Dec 8, 2015
- Analog Devices, Inc.
- Thomas M. Goida
- G01 - MEASURING TESTING
Information Patent Grant
Air-release features in cavity packages
- Patent number 8,853,839
- Issue date Oct 7, 2014
- Analog Devices, Inc.
- Jia Gao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical mount package and wafer level packaging therefor
- Patent number 8,836,132
- Issue date Sep 16, 2014
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method for microelectromechanical systems device pack...
- Patent number 8,692,366
- Issue date Apr 8, 2014
- Analog Device, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical mount package for MEMS sensors
- Patent number 8,624,380
- Issue date Jan 7, 2014
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical mount package for MEMS sensors
- Patent number 8,174,111
- Issue date May 8, 2012
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
CAVITY PACKAGE WITH COMPOSITE SUBSTRATE
- Publication number 20180047675
- Publication date Feb 15, 2018
- Analog Devices, Inc.
- Xiaojie Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS ISOLATION FEATURES FOR STACKED DIES
- Publication number 20170022051
- Publication date Jan 26, 2017
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED DEVICE DIE AND PACKAGE WITH STRESS REDUCTION FEATURES
- Publication number 20160336297
- Publication date Nov 17, 2016
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAVITY PACKAGE WITH COMPOSITE SUBSTRATE
- Publication number 20160300781
- Publication date Oct 13, 2016
- Analog Devices, Inc.
- Xiaojie Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE DIE AND PACKAGE WITH STRESS REDUCTION FEATURES
- Publication number 20150181697
- Publication date Jun 25, 2015
- Analog Devices, Inc.
- Thomas M. Goida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL MOUNT PACKAGE AND WAFER LEVEL PACKAGING THEREFOR
- Publication number 20140374854
- Publication date Dec 25, 2014
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DOUBLE-SIDED PACKAGE
- Publication number 20140217566
- Publication date Aug 7, 2014
- Analog Devices, Inc.
- Thomas M. Goida
- G01 - MEASURING TESTING
Information Patent Application
VERTICAL MOUNT PACKAGE AND WAFER LEVEL PACKAGING THEREFOR
- Publication number 20130256896
- Publication date Oct 3, 2013
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR AIR-RELEASE IN CAVITY PACKAGES
- Publication number 20130093031
- Publication date Apr 18, 2013
- Analog Devices, Inc.
- Jia Gao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Vertical Mount Package for MEMS Sensors
- Publication number 20120235253
- Publication date Sep 20, 2012
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHOD FOR MICROELECTROMECHANICAL SYSTEMS DEVICE PACK...
- Publication number 20120080764
- Publication date Apr 5, 2012
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Vertical Mount Package for MEMS Sensors
- Publication number 20100078739
- Publication date Apr 1, 2010
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Xiaojie Xue

Person

Patents Grantslast 30 patents

Cavity package with composite substrate

Stress isolation features for stacked dies

Cavity package with composite substrate

Integrated device die and package with stress reduction features

Integrated device die and package with stress reduction features

Vertical mount package and wafer level packaging therefor

Double-sided package

Air-release features in cavity packages

Vertical mount package and wafer level packaging therefor

Apparatus and method for microelectromechanical systems device pack...

Vertical mount package for MEMS sensors

Vertical mount package for MEMS sensors

Patents Applicationslast 30 patents

CAVITY PACKAGE WITH COMPOSITE SUBSTRATE

STRESS ISOLATION FEATURES FOR STACKED DIES

INTEGRATED DEVICE DIE AND PACKAGE WITH STRESS REDUCTION FEATURES

CAVITY PACKAGE WITH COMPOSITE SUBSTRATE

INTEGRATED DEVICE DIE AND PACKAGE WITH STRESS REDUCTION FEATURES

VERTICAL MOUNT PACKAGE AND WAFER LEVEL PACKAGING THEREFOR

DOUBLE-SIDED PACKAGE

VERTICAL MOUNT PACKAGE AND WAFER LEVEL PACKAGING THEREFOR

SYSTEMS AND METHODS FOR AIR-RELEASE IN CAVITY PACKAGES

Vertical Mount Package for MEMS Sensors

APPARATUS AND METHOD FOR MICROELECTROMECHANICAL SYSTEMS DEVICE PACK...

Vertical Mount Package for MEMS Sensors