Xiaojing LIAO

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded substrate, circuit board assembly, and electronic device
- Patent number 12,224,146
- Issue date Feb 11, 2025
- Huawei Technologies Co., Ltd.
- Chao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,075,558
- Issue date Aug 27, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Zhaozheng Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless transmission module and manufacturing method
- Patent number 11,538,774
- Issue date Dec 27, 2022
- Huawei Technologies Co., Ltd.
- Qijing He
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE, POWER CONVERSION DEVICE, AND VEHICLE
- Publication number 20240321761
- Publication date Sep 26, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Hao PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND COMMUNICATION DEVICE
- Publication number 20230299018
- Publication date Sep 21, 2023
- Huawei Technologies Co., Ltd
- Chen KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY MODULE AND POWER DEVICE
- Publication number 20230036995
- Publication date Feb 2, 2023
- Huawei Digital Power Technologies Co., Ltd.
- Xiaojing LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
- Publication number 20230028233
- Publication date Jan 26, 2023
- Huawei Technologies Co., Ltd
- Chao SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE ASSEMBLY, ELECTRONIC DEVICE, AND PREPARATION METHOD OF...
- Publication number 20230021432
- Publication date Jan 26, 2023
- Huawei Technologies Co., Ltd
- Hao PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGE SYSTEM
- Publication number 20230018603
- Publication date Jan 19, 2023
- Huawei Technologies Co., Ltd
- Hao PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220201837
- Publication date Jun 23, 2022
- Huawei Digital Power Technologies Co., Ltd.
- Zhaozheng HOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRELESS TRANSMISSION MODULE AND MANUFACTURING METHOD
- Publication number 20210082842
- Publication date Mar 18, 2021
- Huawei Technologies Co., Ltd
- Qijing HE
- H01 - BASIC ELECTRIC ELEMENTS

Xiaojing LIAO

Person

Patents Grantslast 30 patents

Embedded substrate, circuit board assembly, and electronic device

Printed circuit board

Wireless transmission module and manufacturing method

Patents Applicationslast 30 patents

POWER MODULE, POWER CONVERSION DEVICE, AND VEHICLE

PACKAGE SUBSTRATE AND COMMUNICATION DEVICE

POWER SUPPLY MODULE AND POWER DEVICE

EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE

CHIP PACKAGE ASSEMBLY, ELECTRONIC DEVICE, AND PREPARATION METHOD OF...

PACKAGE STRUCTURE AND PACKAGE SYSTEM

PRINTED CIRCUIT BOARD

WIRELESS TRANSMISSION MODULE AND MANUFACTURING METHOD