Xiaoju YU

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package comprising a solder resist layer configured as a seating pl...
- Patent number 11,626,336
- Issue date Apr 11, 2023
- QUALCOMM Incorporated
- Daniel Garcia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solenoid structure with conductive pillar technology
- Patent number 10,693,432
- Issue date Jun 23, 2020
- QUALCOMMM Incorporated
- Nosun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductors formed with through glass vias
- Patent number 10,614,942
- Issue date Apr 7, 2020
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of through glass via (TGV) filter and acoustic filter
- Patent number 10,582,609
- Issue date Mar 3, 2020
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Close proximity tunable inductive elements
- Patent number 10,490,621
- Issue date Nov 26, 2019
- QUALCOMM Incorporated
- Paragkumar Ajaybhai Thadesar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor with metal-insulator-metal (MIM) capacitor
- Patent number 10,292,269
- Issue date May 14, 2019
- QUALCOMM Incorporated
- Niranjan Sunil Mudakatte
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING A SOLDER RESIST LAYER CONFIGURED AS A SEATING PL...
- Publication number 20210098320
- Publication date Apr 1, 2021
- QUALCOMM Incorporated
- Daniel GARCIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-DIE ELECTROSTATIC DISCHARGE PROTECTION
- Publication number 20210057404
- Publication date Feb 25, 2021
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FILTER TECHNOLOGY WITH EMBEDDED DEVICES
- Publication number 20200091094
- Publication date Mar 19, 2020
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INDUCTORS FORMED WITH THROUGH GLASS VIAS
- Publication number 20200020473
- Publication date Jan 16, 2020
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLENOID STRUCTURE WITH CONDUCTIVE PILLAR TECHNOLOGY
- Publication number 20190356294
- Publication date Nov 21, 2019
- QUALCOMM Incorporated
- Nosun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF THROUGH GLASS VIA (TGV) FILTER AND ACOUSTIC FILTER
- Publication number 20190132942
- Publication date May 2, 2019
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SHAPED CIRCUIT WAFERS
- Publication number 20190035621
- Publication date Jan 31, 2019
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Package comprising a solder resist layer configured as a seating pl...

Solenoid structure with conductive pillar technology

Inductors formed with through glass vias

Integration of through glass via (TGV) filter and acoustic filter

Close proximity tunable inductive elements

Inductor with metal-insulator-metal (MIM) capacitor

Patents Applicationslast 30 patents

PACKAGE COMPRISING A SOLDER RESIST LAYER CONFIGURED AS A SEATING PL...

ON-DIE ELECTROSTATIC DISCHARGE PROTECTION

INTEGRATED FILTER TECHNOLOGY WITH EMBEDDED DEVICES

INDUCTORS FORMED WITH THROUGH GLASS VIAS

SOLENOID STRUCTURE WITH CONDUCTIVE PILLAR TECHNOLOGY

INTEGRATION OF THROUGH GLASS VIA (TGV) FILTER AND ACOUSTIC FILTER

SHAPED CIRCUIT WAFERS