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Xiaolian Zhang
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San Jose, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Method for packaging ultra-thin chip with solder ball thermo-compre...
Patent number
8,563,417
Issue date
Oct 22, 2013
Alpha & Omega Semiconductor, Inc.
Jun Lu
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
Compact Power Semiconductor Package and Method with Stacked Inducto...
Publication number
20090160595
Publication date
Jun 25, 2009
Tao Feng
H01 - BASIC ELECTRIC ELEMENTS