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Shanghai, CN
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last 30 patents
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Patent Grant
Underfill composition and packaging process using the same
Patent number
9,688,892
Issue date
Jun 27, 2017
Henkel AG & Co. KGaA
Xiaolong Hu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Thermally Conductive Silicone Composition
Publication number
20240076496
Publication date
Mar 7, 2024
Henkel AG & Co. KGaA
Wentao Xing
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
UNDERFILL COMPOSITION AND PACKAGING PROCESS USING THE SAME
Publication number
20150322309
Publication date
Nov 12, 2015
Henkel IP & Holding GmbH
Xiaolong Hu
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...