Xiaomin BIN

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of electroless plating using a solution with at least two bo...
- Patent number 9,818,617
- Issue date Nov 14, 2017
- Lam Research Corporation
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless plating solution with at least two borane containing re...
- Patent number 9,551,074
- Issue date Jan 24, 2017
- Lam Research Corporation
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process to reduce nodule formation in electroless plating
- Patent number 9,142,416
- Issue date Sep 22, 2015
- Lam Research Corporation
- Nanhai Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless copper deposition with suppressor
- Patent number 8,828,863
- Issue date Sep 9, 2014
- Lam Research Corporation
- William T. Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLESS PLATING SOLUTION WITH AT LEAST TWO BORANE CONTAINING RE...
- Publication number 20170092499
- Publication date Mar 30, 2017
- LAM RESEARCH CORPORATION
- Artur KOLICS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS PLATING WITH AT LEAST TWO BORANE REDUCING AGENTS
- Publication number 20150354064
- Publication date Dec 10, 2015
- LAM RESEARCH CORPORATION
- Artur KOLICS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...