Xiaoming LI

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Jiangsu, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method for wafer etching in deep silicon trench etching process
- Patent number 9,728,472
- Issue date Aug 8, 2017
- CSMC Technologies FAB1 Co., Ltd.
- Anna Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Critical size compensating method of deep groove etching process
- Patent number 9,431,308
- Issue date Aug 30, 2016
- CSMC TECHNOLOGIES FAB1 CO., LTD.
- Anna Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR WAFER ETCHING IN DEEP SILICON TRENCH ETCHING PROCESS
- Publication number 20150332981
- Publication date Nov 19, 2015
- CSMC TECHNOLOGIES FAB1 CO., LTD.
- Anna ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRITICAL SIZE COMPENSATING METHOD OF DEEP GROOVE ETCHING PROCESS
- Publication number 20150279749
- Publication date Oct 1, 2015
- CSMC TECHNOLOGIES FABI CO., LTD.
- Anna Zhang
- H01 - BASIC ELECTRIC ELEMENTS