Xiaoming Sui

Follow

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level chip scale package structure and manufacturing method t...
- Patent number 11,062,969
- Issue date Jul 13, 2021
- Alpha and Omega Semiconductor (Cayman) LTD
- Cheow Khoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package structure and manufacturing method t...
- Patent number 10,242,926
- Issue date Mar 26, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Cheow Khoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-side exposed semiconductor package with ultra-thin die and man...
- Patent number 9,437,528
- Issue date Sep 6, 2016
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20190157174
- Publication date May 23, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Cheow Khoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20180005912
- Publication date Jan 4, 2018
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Cheow Khoon Oh
- H01 - BASIC ELECTRIC ELEMENTS