Xiaonan Zhang

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Patterned grounds and methods of forming the same
- Patent number 10,109,584
- Issue date Oct 23, 2018
- QUALCOMM Incorporated
- Uei-Ming Jow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded layered inductor
- Patent number 10,051,741
- Issue date Aug 14, 2018
- QUALCOMM Incorporated
- Young Kyu Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip employing integrated cavity filter, and related component...
- Patent number 9,812,752
- Issue date Nov 7, 2017
- QUALCOMM Incorporated
- John Jong-Hoon Lee
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Solenoid inductor in a substrate
- Patent number 9,806,144
- Issue date Oct 31, 2017
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising stacks of interconnects, interconnect on solde...
- Patent number 9,691,694
- Issue date Jun 27, 2017
- QUALCOMM Incorporated
- Uei-Ming Jow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer interconnected spiral capacitor
- Patent number 9,653,533
- Issue date May 16, 2017
- QUALCOMM Incorporated
- Uei-Ming Jow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor structure in a semiconductor device
- Patent number 9,576,718
- Issue date Feb 21, 2017
- QUALCOMM Incorporated
- Uei-Ming Jow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package substrate capacitor with configurable/controllable...
- Patent number 9,449,762
- Issue date Sep 20, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip employing integrated cavity filter, and related component...
- Patent number 9,443,810
- Issue date Sep 13, 2016
- QUALCOMM Incorporated
- John Jong-Hoon Lee
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High quality factor filter implemented in wafer level packaging (WL...
- Patent number 9,373,583
- Issue date Jun 21, 2016
- QUALCOMM Incorporated
- Jong-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package (PoP) integrated device comprising a capacitor i...
- Patent number 9,368,566
- Issue date Jun 14, 2016
- QUALCOMM Incorporated
- Jong-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device (IPD) on substrate
- Patent number 9,362,218
- Issue date Jun 7, 2016
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Toroid inductor in an integrated device
- Patent number 9,324,779
- Issue date Apr 26, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor
- Patent number 9,263,186
- Issue date Feb 16, 2016
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High quality factor inductor and high quality factor filter in pack...
- Patent number 9,247,647
- Issue date Jan 26, 2016
- QUALCOMM Incorporated
- Jung Ho Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor design on floating UBM balls for wafer level package (WLP)
- Patent number 9,245,940
- Issue date Jan 26, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High quality factor inductor implemented in wafer level packaging (...
- Patent number 9,035,421
- Issue date May 19, 2015
- QUALCOMM Incorporated
- Young K. Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and circuit to generate race condition test data at multiple...
- Patent number 8,631,368
- Issue date Jan 14, 2014
- QUALCOMM Incorporated
- Xiaoliang Bai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for characterizing and reducing proximity effe...
- Patent number 8,584,075
- Issue date Nov 12, 2013
- QUALCOMM Incorporated
- Animesh Datta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Yield based flop hold time and setup time definition
- Patent number 8,356,263
- Issue date Jan 15, 2013
- QUALCOMM Incorporated
- Xiaonan Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Alternating inverters for capacitive coupling reduction in transmis...
- Patent number 5,994,946
- Issue date Nov 30, 1999
- Metaflow Technologies, Inc.
- Xiaonan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Speed-up circuit for NPN bipolar transistors
- Patent number 4,914,320
- Issue date Apr 3, 1990
- Unisys Corporation
- Xiaonan Zhang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
ESD protection circuit employing channel depletion
- Patent number 4,835,653
- Issue date May 30, 1989
- Unisys Corporation
- Xiaonan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phantom ESD protection circuit employing E-field crowding
- Patent number 4,750,081
- Issue date Jun 7, 1988
- Unisys Corporation
- Xiaonan Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LAND GRID BASED MULTI SIZE PAD PACKAGE
- Publication number 20180053740
- Publication date Feb 22, 2018
- QUALCOMM Incorporated
- Manoj KAKADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP EMPLOYING INTEGRATED CAVITY FILTER, AND RELATED COMPONENT...
- Publication number 20170077574
- Publication date Mar 16, 2017
- QUALCOMM Incorporated
- John Jong-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURE IN A SEMICONDUCTOR DEVICE
- Publication number 20160372253
- Publication date Dec 22, 2016
- QUALCOMM Incorporated
- Uei-Ming Jow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER INTERCONNECTED SPIRAL CAPACITOR
- Publication number 20160240606
- Publication date Aug 18, 2016
- QUALCOMM Incorporated
- Uei-Ming JOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING STACKS OF INTERCONNECTS, INTERCONNECT ON SOLDE...
- Publication number 20160240463
- Publication date Aug 18, 2016
- QUALCOMM Incorporated
- Uei-Ming Jow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, APPARATUS, AND METHOD FOR SEMICONDUCTOR PACKAGE GROUNDS
- Publication number 20160172274
- Publication date Jun 16, 2016
- QUALCOMM Incorporated
- Jung Ho YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED GROUNDS AND METHODS OF FORMING THE SAME
- Publication number 20160066414
- Publication date Mar 3, 2016
- QUALCOMM Incorporated
- Uei-Ming JOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A CAPACITOR I...
- Publication number 20160020193
- Publication date Jan 21, 2016
- QUALCOMM Incorporated
- Jong-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE SUBSTRATE CAPACITOR WITH CONFIGURABLE/CONTROLLABLE...
- Publication number 20150325375
- Publication date Nov 12, 2015
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-PROFILE PACKAGE WITH PASSIVE DEVICE
- Publication number 20150237732
- Publication date Aug 20, 2015
- QUALCOMM Incorporated
- Mario Francisco Velez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR DESIGN ON FLOATING UBM BALLS FOR WAFER LEVEL PACKAGE (WLP)
- Publication number 20150228707
- Publication date Aug 13, 2015
- QUALCOMM Incorporated
- Young Kyu SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLONOID INDUCTOR IN A SUBSTRATE
- Publication number 20150130021
- Publication date May 14, 2015
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED LAYERED INDUCTOR
- Publication number 20150124418
- Publication date May 7, 2015
- QUALCOMM Incorporated
- Young Kyu Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOROID INDUCTOR IN AN INTEGRATED DEVICE
- Publication number 20150115403
- Publication date Apr 30, 2015
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR PLACEMENT FOR A SUBSTRATE INTEGRATED WITH A TOROIDAL INDU...
- Publication number 20150092314
- Publication date Apr 2, 2015
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE (IPD) ON SUBTRATE
- Publication number 20150048480
- Publication date Feb 19, 2015
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH QUALITY FACTOR FILTER IMPLEMENTED IN WAFER LEVEL PACKAGING (WL...
- Publication number 20140319652
- Publication date Oct 30, 2014
- Jong-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DC/ AC DUAL FUNCTION POWER DELIVERY NETWORK (PDN) DECOUPLING CAPACITOR
- Publication number 20140252544
- Publication date Sep 11, 2014
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH QUALITY FACTOR INDUCTOR IMPLEMENTED IN WAFER LEVEL PACKAGING (...
- Publication number 20140246753
- Publication date Sep 4, 2014
- QUALCOMM Incorporated
- Young K. Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
YIELD BASED FLOP HOLD TIME AND SETUP TIME DEFINITION
- Publication number 20130007681
- Publication date Jan 3, 2013
- QUALCOMM Incorporated
- Xiaonan Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and Apparatus for Characterizing and Reducing Proximity Effe...
- Publication number 20120210284
- Publication date Aug 16, 2012
- QUALCOMM Incorporated
- Animesh Datta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method And Circuit To Generate Race Condition Test Data At Multiple...
- Publication number 20110245948
- Publication date Oct 6, 2011
- QUALCOMM Incorporated
- Xiaoliang Bai
- G06 - COMPUTING CALCULATING COUNTING

Xiaonan Zhang

Person

Patents Grantslast 30 patents

Patterned grounds and methods of forming the same

Embedded layered inductor

Flip-chip employing integrated cavity filter, and related component...

Solenoid inductor in a substrate

Substrate comprising stacks of interconnects, interconnect on solde...

Multi-layer interconnected spiral capacitor

Inductor structure in a semiconductor device

Embedded package substrate capacitor with configurable/controllable...

Flip-chip employing integrated cavity filter, and related component...

High quality factor filter implemented in wafer level packaging (WL...

Package on package (PoP) integrated device comprising a capacitor i...

Integrated passive device (IPD) on substrate

Toroid inductor in an integrated device

DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor

High quality factor inductor and high quality factor filter in pack...

Inductor design on floating UBM balls for wafer level package (WLP)

High quality factor inductor implemented in wafer level packaging (...

Method and circuit to generate race condition test data at multiple...

Method and apparatus for characterizing and reducing proximity effe...

Yield based flop hold time and setup time definition

Alternating inverters for capacitive coupling reduction in transmis...

Speed-up circuit for NPN bipolar transistors

ESD protection circuit employing channel depletion

Phantom ESD protection circuit employing E-field crowding

Patents Applicationslast 30 patents

LAND GRID BASED MULTI SIZE PAD PACKAGE

FLIP-CHIP EMPLOYING INTEGRATED CAVITY FILTER, AND RELATED COMPONENT...

INDUCTOR STRUCTURE IN A SEMICONDUCTOR DEVICE

MULTI-LAYER INTERCONNECTED SPIRAL CAPACITOR

SUBSTRATE COMPRISING STACKS OF INTERCONNECTS, INTERCONNECT ON SOLDE...

SYSTEM, APPARATUS, AND METHOD FOR SEMICONDUCTOR PACKAGE GROUNDS

PATTERNED GROUNDS AND METHODS OF FORMING THE SAME

PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A CAPACITOR I...

EMBEDDED PACKAGE SUBSTRATE CAPACITOR WITH CONFIGURABLE/CONTROLLABLE...

LOW-PROFILE PACKAGE WITH PASSIVE DEVICE

INDUCTOR DESIGN ON FLOATING UBM BALLS FOR WAFER LEVEL PACKAGE (WLP)

SOLONOID INDUCTOR IN A SUBSTRATE

EMBEDDED LAYERED INDUCTOR

TOROID INDUCTOR IN AN INTEGRATED DEVICE

CONNECTOR PLACEMENT FOR A SUBSTRATE INTEGRATED WITH A TOROIDAL INDU...

INTEGRATED PASSIVE DEVICE (IPD) ON SUBTRATE

HIGH QUALITY FACTOR FILTER IMPLEMENTED IN WAFER LEVEL PACKAGING (WL...

DC/ AC DUAL FUNCTION POWER DELIVERY NETWORK (PDN) DECOUPLING CAPACITOR

HIGH QUALITY FACTOR INDUCTOR IMPLEMENTED IN WAFER LEVEL PACKAGING (...

YIELD BASED FLOP HOLD TIME AND SETUP TIME DEFINITION

Method and Apparatus for Characterizing and Reducing Proximity Effe...

Method And Circuit To Generate Race Condition Test Data At Multiple...