Xiaowei Guo

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Tianshui, CN

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Patents Grantslast 30 patents

Information Patent Grant
Dense-pitch small-pad copper wire bonded double IC chip stack packa...
- Patent number 9,312,242
- Issue date Apr 12, 2016
- TIANSHUI HUATIAN TECHNOLOGY CO., LTD.
- Wei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no lead package and production method thereof
- Patent number 9,275,941
- Issue date Mar 1, 2016
- TIANSHUI HUATIAN TECHNOLOGY CO.
- Wenhui Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production method of high-density SIM card package
- Patent number 9,210,813
- Issue date Dec 8, 2015
- TIANSHUI HUATIAN TECHNOLOGY CO., LTD.
- Jianyou Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier-free land grid array IC chip package and preparation method...
- Patent number 9,136,231
- Issue date Sep 15, 2015
- TIANSHUI HUATIAN TECHNOLOGY CO., LTD.
- Xiaowei Guo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
QUAD FLAT NO LEAD PACKAGE AND PRODUCTION METHOD THEREOF
- Publication number 20150102476
- Publication date Apr 16, 2015
- HUATIAN TECHNOLOGY (XI'AN) CO., LTD.
- Wenhui Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSE-PITCH SMALL-PAD COPPER WIRE BONDED DOUBLE IC CHIP STACK PACKA...
- Publication number 20150061099
- Publication date Mar 5, 2015
- TIANSHUI HUATIAN TECHNOLOGY CO., LTD
- Wei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER-FREE LAND GRID ARRAY IC CHIP PACKAGE AND PREPARATION METHOD...
- Publication number 20130334686
- Publication date Dec 19, 2013
- Tianshui Huatian Technology Co., Ltd.
- Xiaowei Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY SIM CARD PACKAGE AND PRODUCTION METHOD THEREOF
- Publication number 20130223018
- Publication date Aug 29, 2013
- Tianshui Huatian Technology Co., Ltd.
- Jianyou Xie
- H01 - BASIC ELECTRIC ELEMENTS