Xiaowu Zhang

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Liquid cooling module and method of forming the same
- Patent number 11,948,861
- Issue date Apr 2, 2024
- Agency for Science, Technology and Research
- Yong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of heat sinks for a semiconductor package
- Patent number 11,515,237
- Issue date Nov 29, 2022
- Agency for Science, Technology and Research
- Gongyue Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding stress testing arrangement and method of determining stress
- Patent number 9,506,823
- Issue date Nov 29, 2016
- Agency for Science, Technology and Research
- Cheryl Sharmani Selvanayagam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and a method of manufacturing a semiconduct...
- Patent number 8,466,550
- Issue date Jun 18, 2013
- Agency for Science, Technology and Research
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230268332
- Publication date Aug 24, 2023
- Agency for Science, Technology and Research
- Gongyue TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID COOLING MODULE AND METHOD OF FORMING THE SAME
- Publication number 20220051967
- Publication date Feb 17, 2022
- Agency for Science, Technology and Research
- Yong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20210296217
- Publication date Sep 23, 2021
- Agency for Science, Technology and Research
- Gongyue TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack Arrangement
- Publication number 20130328209
- Publication date Dec 12, 2013
- Agency for Science, Technology and Research
- Cheryl Sharmani Selvanayagam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Stress Testing Arrangement and Method of Determining Stress
- Publication number 20130199303
- Publication date Aug 8, 2013
- Agency for Science, Technology and Research
- Cheryl Sharmani Selvanayagam
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND A METHOD OF MANUFACTURING A SEMICONDUCT...
- Publication number 20120119390
- Publication date May 17, 2012
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STRAINING A SEMICONDUCTOR WAFER AND A WAFER SUBSTRATE UN...
- Publication number 20100052064
- Publication date Mar 4, 2010
- Agency for Science, Technology and Research
- Guo-Qiang Lo
- H01 - BASIC ELECTRIC ELEMENTS

Xiaowu Zhang

Person

Patents Grantslast 30 patents

Liquid cooling module and method of forming the same

Plurality of heat sinks for a semiconductor package

Bonding stress testing arrangement and method of determining stress

Semiconductor structure and a method of manufacturing a semiconduct...

Patents Applicationslast 30 patents

POWER MODULE PACKAGE AND METHOD OF FORMING THE SAME

LIQUID COOLING MODULE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Stack Arrangement

Bonding Stress Testing Arrangement and Method of Determining Stress

SEMICONDUCTOR STRUCTURE AND A METHOD OF MANUFACTURING A SEMICONDUCT...

METHOD FOR STRAINING A SEMICONDUCTOR WAFER AND A WAFER SUBSTRATE UN...