Xiaoxiong Gu

Person

White Plains, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Phased array system-in package supporting spatio-spectral division...
- Patent number 11,764,468
- Issue date Sep 19, 2023
- International Business Machines Corporation
- Alberto Valdes Garcia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communications package with integrated antenna array
- Patent number 11,658,390
- Issue date May 23, 2023
- International Business Machines Corporation
- Christian W. Baks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated antenna array packaging structures and methods
- Patent number 11,189,905
- Issue date Nov 30, 2021
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable phased array package
- Patent number 10,826,194
- Issue date Nov 3, 2020
- International Business Machines Corporation
- Xiaoxiong Gu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Scalable phased array package
- Patent number 10,784,563
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communications package with integrated antenna array
- Patent number 10,594,019
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Christian W. Baks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-in-package structures with broadside and end-fire radiations
- Patent number 10,431,892
- Issue date Oct 1, 2019
- International Business Machines Corporation
- Alberto V. Garcia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Millimeter-wave communications on a multifunction platform
- Patent number 10,381,730
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Xiaoxiong Gu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Antenna-in-package structures with broadside and end-fire radiations
- Patent number 10,170,838
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Alberto V. Garcia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wireless communications package with integrated antennas and air ca...
- Patent number 9,985,346
- Issue date May 29, 2018
- International Business Machines Corporation
- Christian Wilhelmus Baks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-in-package structures with broadside and end-fire radiations
- Patent number 9,917,368
- Issue date Mar 13, 2018
- International Business Machines Corporation
- Alberto V. Garcia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Millimeter-wave communications on a multifunction platform
- Patent number 9,912,061
- Issue date Mar 6, 2018
- International Business Machines Corporation
- Xiaoxiong Gu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Millimeter-wave communications on a multifunction platform
- Patent number 9,831,558
- Issue date Nov 28, 2017
- International Business Machines Corporation
- Xiaoxiong Gu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Antenna-in-package structures with broadside and end-fire radiations
- Patent number 9,819,098
- Issue date Nov 14, 2017
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-in-package structures with broadside and end-fire radiations
- Patent number 9,806,422
- Issue date Oct 31, 2017
- International Business Machines Corporation
- Alberto V. Garcia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Millimeter-wave communications on a multifunction platform
- Patent number 9,660,345
- Issue date May 23, 2017
- International Business Machines Corporation
- Xiaoxiong Gu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wireless communications package with integrated antennas and air ca...
- Patent number 9,620,464
- Issue date Apr 11, 2017
- International Business Machines Corporation
- Christian Wilhelmus Baks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Axiocentric scrubbing land grid array contacts and methods for fabr...
- Patent number 9,565,759
- Issue date Feb 7, 2017
- GLOBALFOUNDRIES Inc.
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phased-array transceiver
- Patent number 9,537,224
- Issue date Jan 3, 2017
- International Business Machines Corporation
- Daniel J. Friedman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Phased-array transceiver
- Patent number 9,203,159
- Issue date Dec 1, 2015
- International Business Machines Corporation
- Daniel J. Friedman
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Millimeter-wave radio frequency integrated circuit packages with in...
- Patent number 9,196,951
- Issue date Nov 24, 2015
- International Business Machines Corporation
- Christian W. Baks
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Axiocentric scrubbing land grid array contacts and methods for fabr...
- Patent number 9,040,841
- Issue date May 26, 2015
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallurgical clamshell methods for micro land grid array fabrication
- Patent number 8,959,764
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through silicon via noise suppression using buried interface contacts
- Patent number 8,809,995
- Issue date Aug 19, 2014
- International Business Machines Corporation
- Xiaomin Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid conductor through-silicon-via for power distribution and sig...
- Patent number 8,796,140
- Issue date Aug 5, 2014
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid conductor through-silicon-via for power distribution and sig...
- Patent number 8,791,550
- Issue date Jul 29, 2014
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallurgical clamshell methods for micro land grid array fabrication
- Patent number 8,651,877
- Issue date Feb 18, 2014
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Axiocentric scrubbing land grid array contacts and methods for fabr...
- Patent number 8,263,879
- Issue date Sep 11, 2012
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PHASED ARRAY SYSTEM-IN PACKAGE SUPPORTING SPATIO-SPECTRAL DIVISION...
- Publication number 20230074376
- Publication date Mar 9, 2023
- International Business Machines Corporation
- Alberto Valdes Garcia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS COMMUNICATIONS PACKAGE WITH INTEGRATED ANTENNA ARRAY
- Publication number 20200161744
- Publication date May 21, 2020
- International Business Machines Corporation
- Christian W. Baks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ANTENNA ARRAY PACKAGING STRUCTURES AND METHODS
- Publication number 20190319338
- Publication date Oct 17, 2019
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE PHASED ARRAY PACKAGE
- Publication number 20190260109
- Publication date Aug 22, 2019
- International Business Machines Corporation
- Xiaoxiong Gu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCALABLE PHASED ARRAY PACKAGE
- Publication number 20190260138
- Publication date Aug 22, 2019
- International Business Machines Corporation
- Xiaoxiong Gu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRELESS COMMUNICATIONS PACKAGE WITH INTEGRATED ANTENNA ARRAY
- Publication number 20180159203
- Publication date Jun 7, 2018
- International Business Machines Corporation
- Christian W. Baks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER-WAVE COMMUNICATIONS ON A MULTIFUNCTION PLATFORM
- Publication number 20180108995
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA-IN-PACKAGE STRUCTURES WITH BROADSIDE AND END-FIRE RADIATIONS
- Publication number 20180076526
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Alberto V. Garcia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER-WAVE COMMUNICATIONS ON A MULTIFUNCTION PLATFORM
- Publication number 20170338563
- Publication date Nov 23, 2017
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER-WAVE COMMUNICATIONS ON A MULTIFUNCTION PLATFORM
- Publication number 20170338564
- Publication date Nov 23, 2017
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA-IN-PACKAGE STRUCTURES WITH BROADSIDE AND END-FIRE RADIATIONS
- Publication number 20170317418
- Publication date Nov 2, 2017
- International Business Machines Corporation
- Alberto V. Garcia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRELESS COMMUNICATIONS PACKAGE WITH INTEGRATED ANTENNAS AND AIR CA...
- Publication number 20170125895
- Publication date May 4, 2017
- International Business Machines Corporation
- Christian Wilhelmus Baks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA-IN-PACKAGE STRUCTURES WITH BROADSIDE AND END-FIRE RADIATIONS
- Publication number 20160172761
- Publication date Jun 16, 2016
- International Business Machines Corporation
- Alberto V. Garcia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA-IN-PACKAGE STRUCTURES WITH BROADSIDE AND END-FIRE RADIATIONS
- Publication number 20160056544
- Publication date Feb 25, 2016
- International Business Machines Corporation
- Alberto V. Garcia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS COMMUNICATIONS PACKAGE WITH INTEGRATED ANTENNAS AND AIR CA...
- Publication number 20160049723
- Publication date Feb 18, 2016
- International Business Machines Corporation
- Christian Wilhelmus Baks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABR...
- Publication number 20150334830
- Publication date Nov 19, 2015
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASED-ARRAY TRANSCEIVER
- Publication number 20150288077
- Publication date Oct 8, 2015
- International Business Machines Corporation
- Daniel J. Friedman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20150133001
- Publication date May 14, 2015
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA-IN-PACKAGE STRUCTURES WITH BROADSIDE AND END-FIRE RADIATIONS
- Publication number 20150070228
- Publication date Mar 12, 2015
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CONDUCTOR THROUGH-SILICON-VIA FOR POWER DISTRIBUTION AND SIG...
- Publication number 20140199834
- Publication date Jul 17, 2014
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CONDUCTOR THROUGH-SILICON-VIA FOR POWER DISTRIBUTION AND SIG...
- Publication number 20140197522
- Publication date Jul 17, 2014
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER-WAVE RADIO FREQUENCY INTEGRATED CIRCUIT PACKAGES WITH IN...
- Publication number 20140145883
- Publication date May 29, 2014
- International Business Machines Corporation
- Christian W. Baks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA NOISE SUPPRESSION USING BURIED INTERFACE CONTACTS
- Publication number 20130221484
- Publication date Aug 29, 2013
- International Business Machines Corporation
- Xiaomin Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20130072073
- Publication date Mar 21, 2013
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABR...
- Publication number 20120325541
- Publication date Dec 27, 2012
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABR...
- Publication number 20110108316
- Publication date May 12, 2011
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20110111647
- Publication date May 12, 2011
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Xiaoxiong Gu

Person

Patents Grantslast 30 patents

Phased array system-in package supporting spatio-spectral division...

Wireless communications package with integrated antenna array

Integrated antenna array packaging structures and methods

Scalable phased array package

Scalable phased array package

Wireless communications package with integrated antenna array

Antenna-in-package structures with broadside and end-fire radiations

Millimeter-wave communications on a multifunction platform

Antenna-in-package structures with broadside and end-fire radiations

Wireless communications package with integrated antennas and air ca...

Antenna-in-package structures with broadside and end-fire radiations

Millimeter-wave communications on a multifunction platform

Millimeter-wave communications on a multifunction platform

Antenna-in-package structures with broadside and end-fire radiations

Antenna-in-package structures with broadside and end-fire radiations

Millimeter-wave communications on a multifunction platform

Wireless communications package with integrated antennas and air ca...

Axiocentric scrubbing land grid array contacts and methods for fabr...

Phased-array transceiver

Phased-array transceiver

Millimeter-wave radio frequency integrated circuit packages with in...

Axiocentric scrubbing land grid array contacts and methods for fabr...

Metallurgical clamshell methods for micro land grid array fabrication

Through silicon via noise suppression using buried interface contacts

Hybrid conductor through-silicon-via for power distribution and sig...

Hybrid conductor through-silicon-via for power distribution and sig...

Metallurgical clamshell methods for micro land grid array fabrication

Axiocentric scrubbing land grid array contacts and methods for fabr...

Patents Applicationslast 30 patents

PHASED ARRAY SYSTEM-IN PACKAGE SUPPORTING SPATIO-SPECTRAL DIVISION...

WIRELESS COMMUNICATIONS PACKAGE WITH INTEGRATED ANTENNA ARRAY

INTEGRATED ANTENNA ARRAY PACKAGING STRUCTURES AND METHODS

SCALABLE PHASED ARRAY PACKAGE

SCALABLE PHASED ARRAY PACKAGE

WIRELESS COMMUNICATIONS PACKAGE WITH INTEGRATED ANTENNA ARRAY

MILLIMETER-WAVE COMMUNICATIONS ON A MULTIFUNCTION PLATFORM

ANTENNA-IN-PACKAGE STRUCTURES WITH BROADSIDE AND END-FIRE RADIATIONS

MILLIMETER-WAVE COMMUNICATIONS ON A MULTIFUNCTION PLATFORM

MILLIMETER-WAVE COMMUNICATIONS ON A MULTIFUNCTION PLATFORM

ANTENNA-IN-PACKAGE STRUCTURES WITH BROADSIDE AND END-FIRE RADIATIONS

WIRELESS COMMUNICATIONS PACKAGE WITH INTEGRATED ANTENNAS AND AIR CA...

ANTENNA-IN-PACKAGE STRUCTURES WITH BROADSIDE AND END-FIRE RADIATIONS

ANTENNA-IN-PACKAGE STRUCTURES WITH BROADSIDE AND END-FIRE RADIATIONS

WIRELESS COMMUNICATIONS PACKAGE WITH INTEGRATED ANTENNAS AND AIR CA...

AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABR...

PHASED-ARRAY TRANSCEIVER

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

ANTENNA-IN-PACKAGE STRUCTURES WITH BROADSIDE AND END-FIRE RADIATIONS

HYBRID CONDUCTOR THROUGH-SILICON-VIA FOR POWER DISTRIBUTION AND SIG...

HYBRID CONDUCTOR THROUGH-SILICON-VIA FOR POWER DISTRIBUTION AND SIG...

MILLIMETER-WAVE RADIO FREQUENCY INTEGRATED CIRCUIT PACKAGES WITH IN...

THROUGH SILICON VIA NOISE SUPPRESSION USING BURIED INTERFACE CONTACTS

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABR...

AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABR...

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION