Xiaoyan Huang

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Hillsborough, NJ, US

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Patents Grantslast 30 patents

Information Patent Grant
Conductive material and process
- Patent number 10,999,933
- Issue date May 4, 2021
- Henkel IP & Holding GmbH
- Bin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature debondable adhesive
- Patent number 9,850,409
- Issue date Dec 26, 2017
- Henkel AG & Co. KGaA
- Wenhua Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
HIGH TEMPERATURE DEBONDABLE ADHESIVE
- Publication number 20160068720
- Publication date Mar 10, 2016
- Henkel IP & Holding GmbH
- Wenhua Zhang
- B32 - LAYERED PRODUCTS
Information Patent Application
CONDUCTIVE MATERIAL AND PROCESS
- Publication number 20140178601
- Publication date Jun 26, 2014
- Bin Wei
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS