Xiaoyi Ding

Person

Lake Zurich, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Humidity resistant sensors and methods of making same
- Patent number 10,352,806
- Issue date Jul 16, 2019
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Embedded structures for high glass strength and robust packaging
- Patent number 10,189,707
- Issue date Jan 29, 2019
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Embedded structures for high glass strength and robust packaging
- Patent number 9,676,618
- Issue date Jun 13, 2017
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Humidity resistant sensors and methods of making same
- Patent number 9,574,961
- Issue date Feb 21, 2017
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Absolute pressure sensor with improved cap bonding boundary
- Patent number 9,546,922
- Issue date Jan 17, 2017
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- G01 - MEASURING TESTING
Information Patent Grant
Piezoresistive transducer with low thermal noise
- Patent number 9,395,259
- Issue date Jul 19, 2016
- Continental Automotive Systems, Inc.
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING
Information Patent Grant
Cap side bonding structure for backside absolute pressure sensors
- Patent number 8,878,316
- Issue date Nov 4, 2014
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin semiconductor device having embedded die support and methods o...
- Patent number 8,791,540
- Issue date Jul 29, 2014
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin semiconductor device having embedded die support and methods o...
- Patent number 8,791,539
- Issue date Jul 29, 2014
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin semiconductor die package
- Patent number 8,618,675
- Issue date Dec 31, 2013
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor for harsh media sensing and flexible packaging
- Patent number 8,215,176
- Issue date Jul 10, 2012
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- G01 - MEASURING TESTING
Information Patent Grant
Thin semiconductor device having embedded die support and methods o...
- Patent number 8,164,153
- Issue date Apr 24, 2012
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level sealed microdevice having trench isolation and methods...
- Patent number 7,378,294
- Issue date May 27, 2008
- Temic Automotive of North America, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed microdevice with getter shield
- Patent number 7,204,737
- Issue date Apr 17, 2007
- Temic Automotive of North America, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level sealed microdevice having trench isolation and methods...
- Patent number 7,045,868
- Issue date May 16, 2006
- Motorola, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Feedthrough design and method for a hermetically sealed microdevice
- Patent number 6,929,974
- Issue date Aug 16, 2005
- Motorola, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed microdevices having a single crystalline silico...
- Patent number 6,806,557
- Issue date Oct 19, 2004
- Motorola, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selectable pressure sensor
- Patent number 6,142,021
- Issue date Nov 7, 2000
- Motorola, Inc.
- Carl Ross
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED STRUCTURES FOR HIGH GLASS STRENGTH AND ROBUST PACKAGING
- Publication number 20170225950
- Publication date Aug 10, 2017
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HUMIDITY RESISTANT SENSORS AND METHODS OF MAKING SAME
- Publication number 20170115177
- Publication date Apr 27, 2017
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- G01 - MEASURING TESTING
Information Patent Application
EMBEDDED STRUCTURES FOR HIGH GLASS STRENGTH AND ROBUST PACKAGING
- Publication number 20160244322
- Publication date Aug 25, 2016
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HUMIDITY RESISTANT SENSORS AND METHODS OF MAKING SAME
- Publication number 20150292973
- Publication date Oct 15, 2015
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- G01 - MEASURING TESTING
Information Patent Application
Absolute Pressure Sensor With Improved Bonding Boundary
- Publication number 20150040675
- Publication date Feb 12, 2015
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- B32 - LAYERED PRODUCTS
Information Patent Application
CAP BONDING STRUCTURE AND METHOD FOR BACKSIDE ABSOLUTE PRESSURE SEN...
- Publication number 20140239424
- Publication date Aug 28, 2014
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZORESISTIVE TRANSDUCER WITH LOW THERMAL NOISE
- Publication number 20140137653
- Publication date May 22, 2014
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING
Information Patent Application
THIN SEMICONDUCTOR DIE PACKAGE
- Publication number 20130105999
- Publication date May 2, 2013
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Thin Semiconductor Device Having Embedded Die Support and Methods o...
- Publication number 20120153409
- Publication date Jun 21, 2012
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Thin Semiconductor Device Having Embedded Die Support and Methods o...
- Publication number 20120149153
- Publication date Jun 14, 2012
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THIN SEMICONDUCTOR DEVICE HAVING EMBEDDED DIE SUPPORT AND METHODS O...
- Publication number 20100301431
- Publication date Dec 2, 2010
- TEMIC AUTOMOTIVE OF NORTH AMERICA, INC.
- XIAOYI DING
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR FOR HARSH MEDIA SENSING AND FLEXIBLE PACKAGING
- Publication number 20100300207
- Publication date Dec 2, 2010
- TEMIC AUTOMOTIVE OF NORTH AMERICA, INC.
- XIAOYI DING
- G01 - MEASURING TESTING
Information Patent Application
Wafer-level sealed microdevice having trench isolation and methods...
- Publication number 20060105503
- Publication date May 18, 2006
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Hermetically sealed microdevice with getter sheild
- Publication number 20060063462
- Publication date Mar 23, 2006
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer-level sealed microdevice having trench isolation and methods...
- Publication number 20050023629
- Publication date Feb 3, 2005
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Feedthrough design and method for a hermetically sealed microdevice
- Publication number 20040077117
- Publication date Apr 22, 2004
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED MICRODEVICES HAVING A SINGLE CRYSTALLINE SILICO...
- Publication number 20040061207
- Publication date Apr 1, 2004
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Xiaoyi Ding

Person

Patents Grantslast 30 patents

Humidity resistant sensors and methods of making same

Embedded structures for high glass strength and robust packaging

Embedded structures for high glass strength and robust packaging

Humidity resistant sensors and methods of making same

Absolute pressure sensor with improved cap bonding boundary

Piezoresistive transducer with low thermal noise

Cap side bonding structure for backside absolute pressure sensors

Thin semiconductor device having embedded die support and methods o...

Thin semiconductor device having embedded die support and methods o...

Thin semiconductor die package

Pressure sensor for harsh media sensing and flexible packaging

Thin semiconductor device having embedded die support and methods o...

Wafer-level sealed microdevice having trench isolation and methods...

Hermetically sealed microdevice with getter shield

Wafer-level sealed microdevice having trench isolation and methods...

Feedthrough design and method for a hermetically sealed microdevice

Hermetically sealed microdevices having a single crystalline silico...

Selectable pressure sensor

Patents Applicationslast 30 patents

EMBEDDED STRUCTURES FOR HIGH GLASS STRENGTH AND ROBUST PACKAGING

HUMIDITY RESISTANT SENSORS AND METHODS OF MAKING SAME

EMBEDDED STRUCTURES FOR HIGH GLASS STRENGTH AND ROBUST PACKAGING

HUMIDITY RESISTANT SENSORS AND METHODS OF MAKING SAME

Absolute Pressure Sensor With Improved Bonding Boundary

CAP BONDING STRUCTURE AND METHOD FOR BACKSIDE ABSOLUTE PRESSURE SEN...

PIEZORESISTIVE TRANSDUCER WITH LOW THERMAL NOISE

THIN SEMICONDUCTOR DIE PACKAGE

Thin Semiconductor Device Having Embedded Die Support and Methods o...

Thin Semiconductor Device Having Embedded Die Support and Methods o...

THIN SEMICONDUCTOR DEVICE HAVING EMBEDDED DIE SUPPORT AND METHODS O...

PRESSURE SENSOR FOR HARSH MEDIA SENSING AND FLEXIBLE PACKAGING

Wafer-level sealed microdevice having trench isolation and methods...

Hermetically sealed microdevice with getter sheild

Wafer-level sealed microdevice having trench isolation and methods...

Feedthrough design and method for a hermetically sealed microdevice

HERMETICALLY SEALED MICRODEVICES HAVING A SINGLE CRYSTALLINE SILICO...