Xiaoyu JIANG

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Chip bonding device
- Patent number 11,081,380
- Issue date Aug 3, 2021
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Feibiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch bonding apparatus and bonding method
- Patent number 10,763,235
- Issue date Sep 1, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Xiaoyu Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and bonding method
- Patent number 10,658,327
- Issue date May 19, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Tianming Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER HOLDER AND WAFER TRANSFER APPARATUS, SYSTEM AND METHOD
- Publication number 20200286772
- Publication date Sep 10, 2020
- Gang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS AND BONDING METHOD
- Publication number 20200144218
- Publication date May 7, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Tianming WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH BONDING APPARATUS AND BONDING METHOD
- Publication number 20190385972
- Publication date Dec 19, 2019
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Xiaoyu JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING DEVICE
- Publication number 20190378741
- Publication date Dec 12, 2019
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Feibiao CHEN
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL