Xiaoyun WEI

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Dongguan, CN

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Patents Grantslast 30 patents

Information Patent Grant
Chip and manufacturing method thereof, and electronic device
- Patent number 11,862,529
- Issue date Jan 2, 2024
- Huawei Technologies Co., Ltd.
- Chaojun Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnection structure and manufacturing method thereof...
- Patent number 11,776,820
- Issue date Oct 3, 2023
- Huawei Technologies Co., Ltd.
- Xiaoyun Wei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Optical Phased Board, Manufacturing Method, and Optical Phased Arra...
- Publication number 20240085757
- Publication date Mar 14, 2024
- Huawei Technologies Co., Ltd
- Chaojun Deng
- G02 - OPTICS
Information Patent Application
CHIP PACKAGE STRUCTURE, PREPARATION METHOD, AND ELECTRONIC DEVICE
- Publication number 20220216171
- Publication date Jul 7, 2022
- Huawei Technologies Co., Ltd
- Chaojun DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
- Publication number 20220102237
- Publication date Mar 31, 2022
- Huawei Technologies Co., Ltd
- Chaojun DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF...
- Publication number 20220102164
- Publication date Mar 31, 2022
- Huawei Technologies Co., Ltd
- Xiaoyun WEI
- H01 - BASIC ELECTRIC ELEMENTS