Xin-Chung Kuang

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Hsin-Chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 9,446,467
- Issue date Sep 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Air trench in packages incorporating hybrid bonding
- Patent number 9,443,796
- Issue date Sep 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Air Trench in Packages Incorporating Hybrid Bonding
- Publication number 20140264948
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrate Rinse Module in Hybrid Bonding Platform
- Publication number 20140263586
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR