Xin-Hua Huang

Person

Xihu Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate loss reduction for semiconductor devices
- Patent number 12,148,706
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bond structure to increase membrane sensitivity in MEMS...
- Patent number 12,139,399
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3D trench capacitor for integrated passive devices
- Patent number 11,862,612
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 11,854,795
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning a transparent wafer to form an alignment mark in the tra...
- Patent number 11,854,999
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MEMS device and method for making the same
- Patent number 11,851,318
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deposition system for high accuracy patterning
- Patent number 11,818,944
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Yin Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 11,742,321
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning a transparent wafer to form an alignment mark in the tra...
- Patent number 11,721,637
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate loss reduction for semiconductor devices
- Patent number 11,652,058
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous bonding approach for high quality wafer stacking appli...
- Patent number 11,621,186
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low contamination chamber for surface activation
- Patent number 11,508,562
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive bond structure to increase membrane sensitivity in MEMS...
- Patent number 11,292,715
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 11,282,697
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate loss reduction for semiconductor devices
- Patent number 11,222,849
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D trench capacitor for integrated passive devices
- Patent number 11,211,362
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous bonding approach for high quality wafer stacking appli...
- Patent number 11,094,575
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 11,031,369
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Approach for ultra thin-film transfer and handling
- Patent number 10,962,878
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Yin Liu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 10,665,449
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Approach for ultra thin-film transfer and handling
- Patent number 10,509,312
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Yin Liu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 10,497,667
- Issue date Dec 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of semiconductor wafer bonding and system thereof
- Patent number 10,410,892
- Issue date Sep 10, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,354,972
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multiple metal layer semiconductor device and low temperature stack...
- Patent number 10,283,448
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a semiconductor structure
- Patent number 10,160,638
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Cheng Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer bonding process and structure
- Patent number 10,128,209
- Issue date Nov 13, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,103,122
- Issue date Oct 16, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for wafer level bonding
- Patent number 10,049,901
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment systems and wafer bonding systems and methods
- Patent number 10,037,968
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240402441
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Kuo-Hao LEE
- G02 - OPTICS
Information Patent Application
SUBSTRATE LOSS REDUCTION FOR SEMICONDUCTOR DEVICES
- Publication number 20240379570
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...
- Publication number 20240367965
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM
- Publication number 20240087879
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES
- Publication number 20240088103
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION SYSTEM FOR HIGH ACCURACY PATTERNING
- Publication number 20230371354
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE LOSS REDUCTION FOR SEMICONDUCTOR DEVICES
- Publication number 20230253334
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...
- Publication number 20230238268
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING A TRANSPARENT WAFER TO FORM AN ALIGNMENT MARK IN THE TRA...
- Publication number 20220375872
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20220340407
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chuan TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...
- Publication number 20220219973
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrate Rinse Module in Hybrid Bonding Platform
- Publication number 20220216052
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE LOSS REDUCTION FOR SEMICONDUCTOR DEVICES
- Publication number 20220130765
- Publication date Apr 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES
- Publication number 20220115358
- Publication date Apr 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING A TRANSPARENT WAFER TO FORM AN ALIGNMENT MARK IN THE TRA...
- Publication number 20210375780
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...
- Publication number 20210335646
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE LOSS REDUCTION FOR SEMICONDUCTOR DEVICES
- Publication number 20210335713
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES
- Publication number 20210296283
- Publication date Sep 23, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BOND WAVE PROPAGATION CONTROL
- Publication number 20210272928
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEPOSITION SYSTEM FOR HIGH ACCURACY PATTERNING
- Publication number 20210273167
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...
- Publication number 20200407220
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...
- Publication number 20200381283
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL APPROACH FOR ULTRA THIN-FILM TRANSFER AND HANDLING
- Publication number 20200064730
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Ping-Yin Liu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
APPARATUS FOR BOND WAVE PROPAGATION CONTROL
- Publication number 20200051950
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrate Rinse Module in Hybrid Bonding Platform
- Publication number 20200006052
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOVEL APPROACH FOR ULTRA THIN-FILM TRANSFER AND HANDLING
- Publication number 20190094682
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Ping-Yin Liu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
APPARATUS FOR BOND WAVE PROPAGATION CONTROL
- Publication number 20190096848
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20190051628
- Publication date Feb 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Metal Layer Semiconductor Device and Low Temperature Stack...
- Publication number 20180226337
- Publication date Aug 9, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEMICONDUCTOR WAFER BONDING AND SYSTEM THEREOF
- Publication number 20180144999
- Publication date May 24, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-LIANG LU
- H01 - BASIC ELECTRIC ELEMENTS

Xin-Hua Huang

Person

Patents Grantslast 30 patents

Substrate loss reduction for semiconductor devices

Conductive bond structure to increase membrane sensitivity in MEMS...

3D trench capacitor for integrated passive devices

Integrate rinse module in hybrid bonding platform

Patterning a transparent wafer to form an alignment mark in the tra...

MEMS device and method for making the same

Deposition system for high accuracy patterning

Apparatus for bond wave propagation control

Patterning a transparent wafer to form an alignment mark in the tra...

Substrate loss reduction for semiconductor devices

Simultaneous bonding approach for high quality wafer stacking appli...

Low contamination chamber for surface activation

Conductive bond structure to increase membrane sensitivity in MEMS...

Integrate rinse module in hybrid bonding platform

Substrate loss reduction for semiconductor devices

3D trench capacitor for integrated passive devices

Simultaneous bonding approach for high quality wafer stacking appli...

Apparatus for bond wave propagation control

Approach for ultra thin-film transfer and handling

Integrate rinse module in hybrid bonding platform

Approach for ultra thin-film transfer and handling

Apparatus for bond wave propagation control

Method of semiconductor wafer bonding and system thereof

Hybrid bonding systems and methods for semiconductor wafers

Multiple metal layer semiconductor device and low temperature stack...

Method and apparatus for a semiconductor structure

Wafer bonding process and structure

Hybrid bonding systems and methods for semiconductor wafers

Apparatus and method for wafer level bonding

Alignment systems and wafer bonding systems and methods

Patents Applicationslast 30 patents

PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME

SUBSTRATE LOSS REDUCTION FOR SEMICONDUCTOR DEVICES

CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...

INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM

3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES

DEPOSITION SYSTEM FOR HIGH ACCURACY PATTERNING

SUBSTRATE LOSS REDUCTION FOR SEMICONDUCTOR DEVICES

SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...

PATTERNING A TRANSPARENT WAFER TO FORM AN ALIGNMENT MARK IN THE TRA...

MEMS DEVICE AND METHOD FOR MAKING THE SAME

CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...

Integrate Rinse Module in Hybrid Bonding Platform

SUBSTRATE LOSS REDUCTION FOR SEMICONDUCTOR DEVICES

3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES

PATTERNING A TRANSPARENT WAFER TO FORM AN ALIGNMENT MARK IN THE TRA...

SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...

SUBSTRATE LOSS REDUCTION FOR SEMICONDUCTOR DEVICES

3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES

APPARATUS FOR BOND WAVE PROPAGATION CONTROL

DEPOSITION SYSTEM FOR HIGH ACCURACY PATTERNING

CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...

SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...

NOVEL APPROACH FOR ULTRA THIN-FILM TRANSFER AND HANDLING

APPARATUS FOR BOND WAVE PROPAGATION CONTROL

Integrate Rinse Module in Hybrid Bonding Platform

NOVEL APPROACH FOR ULTRA THIN-FILM TRANSFER AND HANDLING

APPARATUS FOR BOND WAVE PROPAGATION CONTROL

Hybrid Bonding Systems and Methods for Semiconductor Wafers

Multiple Metal Layer Semiconductor Device and Low Temperature Stack...

METHOD OF SEMICONDUCTOR WAFER BONDING AND SYSTEM THEREOF