Xin Hui Lee

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Chip scale package and manufacturing method
- Patent number 6,737,300
- Issue date May 18, 2004
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package
- Patent number 6,455,941
- Issue date Sep 24, 2002
- Advanced Semiconductor Engineering, Inc.
- Xin Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chip scale package and manufacturing method
- Publication number 20020142518
- Publication date Oct 3, 2002
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale package and manufacturing method thereof
- Publication number 20020098620
- Publication date Jul 25, 2002
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale package
- Publication number 20020084535
- Publication date Jul 4, 2002
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Xin Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS