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Xin Lu

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Processing method for wafer
    • Patent number 11,094,523
    • Issue date Aug 17, 2021
    • Disco Corporation
    • Xin Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 10,950,504
    • Issue date Mar 16, 2021
    • Disco Corporation
    • Zach Powers
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Packaged wafer processing method
    • Patent number 10,679,910
    • Issue date Jun 9, 2020
    • Disco Corporation
    • Makoto Tanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of manufacturing packaged wafer
    • Patent number 10,269,639
    • Issue date Apr 23, 2019
    • Disco Corporation
    • Hideki Koshimizu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of processing wafer
    • Patent number 10,262,899
    • Issue date Apr 16, 2019
    • Disco Corporation
    • Xin Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Packaged wafer manufacturing method and device chip manufacturing m...
    • Patent number 9,892,986
    • Issue date Feb 13, 2018
    • Disco Corporation
    • Hideki Koshimizu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package wafer processing method
    • Patent number 9,875,948
    • Issue date Jan 23, 2018
    • Disco Corporation
    • Xin Lu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,852,949
    • Issue date Dec 26, 2017
    • Disco Corporation
    • Tetsukazu Sugiya
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,418,908
    • Issue date Aug 16, 2016
    • Disco Corporation
    • Makoto Tanaka
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200176316
    • Publication date Jun 4, 2020
    • Disco Corporation
    • Zach POWERS
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING METHOD FOR WAFER
    • Publication number 20200168451
    • Publication date May 28, 2020
    • Disco Corporation
    • Xin LU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING PACKAGED WAFER
    • Publication number 20170294353
    • Publication date Oct 12, 2017
    • Disco Corporation
    • Hideki Koshimizu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGED WAFER MANUFACTURING METHOD AND DEVICE CHIP MANUFACTURING M...
    • Publication number 20170294364
    • Publication date Oct 12, 2017
    • Disco Corporation
    • Hideki Koshimizu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGED WAFER PROCESSING METHOD
    • Publication number 20170221780
    • Publication date Aug 3, 2017
    • Disco Corporation
    • Makoto Tanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE WAFER PROCESSING METHOD
    • Publication number 20170213774
    • Publication date Jul 27, 2017
    • Disco Corporation
    • Xin Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20170186645
    • Publication date Jun 29, 2017
    • Disco Corporation
    • Xin Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20170069537
    • Publication date Mar 9, 2017
    • Disco Corporation
    • Tetsukazu Sugiya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20160035635
    • Publication date Feb 4, 2016
    • Disco Corporation
    • Makoto Tanaka
    • H01 - BASIC ELECTRIC ELEMENTS