Xin-Wei Lo

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Pingtung County, TW

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Patents Grantslast 30 patents

Information Patent Grant
Electroplating system and pressure device thereof
- Patent number 10,808,331
- Issue date Oct 20, 2020
- Chipbond Technology Corporation
- Cheng-Hung Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chip package having a flexible substrate
- Patent number 10,168,582
- Issue date Jan 1, 2019
- Chipbond Technology Corporation
- Chun-Yang Su
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROPLATING SYSTEM AND PRESSURE DEVICE THEREOF
- Publication number 20190186037
- Publication date Jun 20, 2019
- Chipbond Technology Corporation
- Cheng-Hung Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR