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last 30 patents
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Patent Grant
Semiconductor packaging structure and forming method therefor
Patent number
9,515,010
Issue date
Dec 6, 2016
NANTONG FUJITSU MICROELECTRONICS., LTD.
Xin Xia
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
Semiconductor Packaging Structure And Forming Method Therefor
Publication number
20160043020
Publication date
Feb 11, 2016
Xin XIA
H01 - BASIC ELECTRIC ELEMENTS