Xing Fu

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Kyiv, UA

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Patents Grantslast 30 patents

Information Patent Grant
Chip and manufacturing method thereof, and electronic device
- Patent number 11,862,529
- Issue date Jan 2, 2024
- Huawei Technologies Co., Ltd.
- Chaojun Deng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
- Publication number 20220102237
- Publication date Mar 31, 2022
- Huawei Technologies Co., Ltd
- Chaojun DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermoelectric Cooler, Optical Sub-Assembly, and Optical Module
- Publication number 20210222919
- Publication date Jul 22, 2021
- Huawei Technologies Co., Ltd
- Xing Fu
- H01 - BASIC ELECTRIC ELEMENTS