Xing HU

Person

Hubei, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Metal lead, semiconductor device and methods of fabricating the same
- Patent number 11,646,223
- Issue date May 9, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Tian Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First wafer, fabricating method thereof and wafer stack
- Patent number 11,211,348
- Issue date Dec 28, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Xing Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer, bonding structure and wafer bonding method
- Patent number 11,069,647
- Issue date Jul 20, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yunpeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with vertically separated openings and manufac...
- Patent number 11,043,448
- Issue date Jun 22, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yu Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,943,853
- Issue date Mar 9, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Xing Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER ASSEMBLY HAVING ALIGNMENT MARKS, METHOD FOR FORMING SAME, AND...
- Publication number 20230290732
- Publication date Sep 14, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230163102
- Publication date May 25, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Di ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230053721
- Publication date Feb 23, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Xing HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LEAD, SEMICONDUCTOR DEVICE AND METHODS OF FABRICATING THE SAME
- Publication number 20210175117
- Publication date Jun 10, 2021
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tian ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST WAFER, FABRICATING METHOD THEREOF AND WAFER STACK
- Publication number 20210057359
- Publication date Feb 25, 2021
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Xing HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Wafer, Bonding Structure And Wafer Bonding Method
- Publication number 20200335473
- Publication date Oct 22, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yunpeng ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200075483
- Publication date Mar 5, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yu Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20200075457
- Publication date Mar 5, 2020
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Xing HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200075460
- Publication date Mar 5, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Xing Hu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Metal lead, semiconductor device and methods of fabricating the same

First wafer, fabricating method thereof and wafer stack

Semiconductor wafer, bonding structure and wafer bonding method

Semiconductor device with vertically separated openings and manufac...

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

WAFER ASSEMBLY HAVING ALIGNMENT MARKS, METHOD FOR FORMING SAME, AND...

BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR

BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR

METAL LEAD, SEMICONDUCTOR DEVICE AND METHODS OF FABRICATING THE SAME

FIRST WAFER, FABRICATING METHOD THEREOF AND WAFER STACK

Semiconductor Wafer, Bonding Structure And Wafer Bonding Method

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF