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Singapore, SG
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of forming conductive vias by direc...
Patent number
10,553,487
Issue date
Feb 4, 2020
STATS ChipPAC Pte. Ltd.
Xing Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming conductive vias by backs...
Patent number
10,115,701
Issue date
Oct 30, 2018
STATS ChipPAC Pte. Ltd.
Xing Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming conductive vias by direc...
Patent number
9,768,066
Issue date
Sep 19, 2017
STATS ChipPAC Pte. Ltd.
Xing Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of wafer thinning involving edge tr...
Patent number
9,728,415
Issue date
Aug 8, 2017
STATS ChipPAC Pte. Ltd.
Vinoth Kanna Chockanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit through-substrate via system with a buffer layer...
Patent number
9,281,274
Issue date
Mar 8, 2016
Stats Chippac Ltd.
Xing Zhao
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Method of Forming Conductive Vias by Direc...
Publication number
20170365517
Publication date
Dec 21, 2017
STATS ChipPAC Pte Ltd.
Xing Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Conductive Vias by Direc...
Publication number
20150380310
Publication date
Dec 31, 2015
STATS ChipPAC, Ltd.
Xing Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Conductive Vias by Backs...
Publication number
20150380339
Publication date
Dec 31, 2015
STATS ChipPAC, Ltd.
Xing Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Wafer Thinning Involving Edge Tr...
Publication number
20150179544
Publication date
Jun 25, 2015
STATS ChipPAC, Ltd.
Vinoth Kanna Chockanathan
H01 - BASIC ELECTRIC ELEMENTS