Xinghua Sun

Person

Clifton Park, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for patterning a dielectric layer
- Patent number 11,756,790
- Issue date Sep 12, 2023
- Tokyo Electron Limited
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ALD (atomic layer deposition) liner for via profile control and rel...
- Patent number 11,742,241
- Issue date Aug 29, 2023
- Tokyo Electron Limited
- Xinghua Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized etch stop layer
- Patent number 11,532,517
- Issue date Dec 20, 2022
- Tokyo Electron Limited
- Yun Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of conductive cap for fully-aligned-via (FAV)
- Patent number 11,515,203
- Issue date Nov 29, 2022
- Tokyo Electron Limited
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation of substrates during processing and systems thereof
- Patent number 11,289,325
- Issue date Mar 29, 2022
- Tokyo Electron Limited
- Michael Edley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ALD (atomic layer deposition) liner for via profile control and rel...
- Patent number 11,164,781
- Issue date Nov 2, 2021
- Tokyo Electron Limited
- Xinghua Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing methods for mandrel pull from spacers for multi-color...
- Patent number 11,127,594
- Issue date Sep 21, 2021
- Tokyo Electron Limited
- Xinghua Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio via etch using atomic layer deposition protection...
- Patent number 11,121,027
- Issue date Sep 14, 2021
- Tokyo Electron Limited
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition for low-K trench protection during etch
- Patent number 10,964,587
- Issue date Mar 30, 2021
- Tokyo Electron Limited
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing methods to protect ULK materials from damage during e...
- Patent number 10,304,725
- Issue date May 28, 2019
- Tokyo Electron Limited
- Xinghua Sun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PATTERNING A DIELECTRIC LAYER
- Publication number 20220293419
- Publication date Sep 15, 2022
- TOKYO ELECTRON LIMITED
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radiation of Substrates During Processing and Systems Thereof
- Publication number 20220189764
- Publication date Jun 16, 2022
- TOKYO ELECTRON LIMITED
- Michael Edley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALD (ATOMIC LAYER DEPOSITION) LINER FOR VIA PROFILE CONTROL AND REL...
- Publication number 20220020642
- Publication date Jan 20, 2022
- TOKYO ELECTRON LIMITED
- Xinghua Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radiation of Substrates During Processing and Systems Thereof
- Publication number 20210407790
- Publication date Dec 30, 2021
- TOKYO ELECTRON LIMITED
- Michael Edley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC ETCH STOP LAYER FOR REACTIVE ION ETCH (RIE) LAG REDUCTIO...
- Publication number 20210265205
- Publication date Aug 26, 2021
- TOKYO ELECTRON LIMITED
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF CONDUCTIVE CAP FOR FULLY-ALIGNED-VIA (FAV)
- Publication number 20210242074
- Publication date Aug 5, 2021
- TOKYO ELECTRON LIMITED
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED ETCH STOP LAYER
- Publication number 20210242089
- Publication date Aug 5, 2021
- TOKYO ELECTRON LIMITED
- Yun Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALD (ATOMIC LAYER DEPOSITION) LINER FOR VIA PROFILE CONTROL AND REL...
- Publication number 20200051859
- Publication date Feb 13, 2020
- TOKYO ELECTRON LIMITED
- Xinghua Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Atomic Layer Deposition For Low-K Trench Protection During Etch
- Publication number 20190355617
- Publication date Nov 21, 2019
- TOKYO ELECTRON LIMITED
- David O'Meara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHODS FOR MANDREL PULL FROM SPACERS FOR MULTI-COLOR...
- Publication number 20190189444
- Publication date Jun 20, 2019
- TOKYO ELECTRON LIMITED
- Xinghua Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Aspect Ratio Via Etch Using Atomic Layer Deposition Protection...
- Publication number 20190181041
- Publication date Jun 13, 2019
- TOKYO ELECTRON LIMITED
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHODS TO PROTECT ULK MATERIALS FROM DAMAGE DURING E...
- Publication number 20180061700
- Publication date Mar 1, 2018
- TOKYO ELECTRON LIMITED
- Xinghua Sun
- H01 - BASIC ELECTRIC ELEMENTS

Xinghua Sun

Person

Patents Grantslast 30 patents

Method for patterning a dielectric layer

ALD (atomic layer deposition) liner for via profile control and rel...

Localized etch stop layer

Selective deposition of conductive cap for fully-aligned-via (FAV)

Radiation of substrates during processing and systems thereof

ALD (atomic layer deposition) liner for via profile control and rel...

Manufacturing methods for mandrel pull from spacers for multi-color...

High aspect ratio via etch using atomic layer deposition protection...

Atomic layer deposition for low-K trench protection during etch

Manufacturing methods to protect ULK materials from damage during e...

Patents Applicationslast 30 patents

METHOD FOR PATTERNING A DIELECTRIC LAYER

Radiation of Substrates During Processing and Systems Thereof

ALD (ATOMIC LAYER DEPOSITION) LINER FOR VIA PROFILE CONTROL AND REL...

Radiation of Substrates During Processing and Systems Thereof

DIELECTRIC ETCH STOP LAYER FOR REACTIVE ION ETCH (RIE) LAG REDUCTIO...

SELECTIVE DEPOSITION OF CONDUCTIVE CAP FOR FULLY-ALIGNED-VIA (FAV)

LOCALIZED ETCH STOP LAYER

ALD (ATOMIC LAYER DEPOSITION) LINER FOR VIA PROFILE CONTROL AND REL...

Atomic Layer Deposition For Low-K Trench Protection During Etch

MANUFACTURING METHODS FOR MANDREL PULL FROM SPACERS FOR MULTI-COLOR...

High Aspect Ratio Via Etch Using Atomic Layer Deposition Protection...

MANUFACTURING METHODS TO PROTECT ULK MATERIALS FROM DAMAGE DURING E...