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Patents Grants
last 30 patents
Information
Patent Grant
Fan-out LED packaging structure and method
Patent number
12,132,036
Issue date
Oct 29, 2024
SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
Hanlung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method for preparing the same
Patent number
11,973,046
Issue date
Apr 30, 2024
SJ Semiconductor (Jiangyin) Corporation
Jiashan Yin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip packaging structure and method for preparing same
Patent number
11,798,888
Issue date
Oct 24, 2023
SJ Semiconductor (Jiangyin) Corporation
Yayuan Xue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method for preparing the same
Patent number
11,728,158
Issue date
Aug 15, 2023
SJ Semiconductor (Jiangyin) Corporation
Jiashan Yin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME
Publication number
20220189878
Publication date
Jun 16, 2022
SJ Semiconductor(Jiangyin) Corporation
Yayuan Xue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE PICKUP DEVICE AND METHOD
Publication number
20220165590
Publication date
May 26, 2022
SJ Semiconductor(Jiangyin) Corporation
Chunying ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT LED PACKAGING STRUCTURE AND METHOD
Publication number
20220093580
Publication date
Mar 24, 2022
SJ Semiconductor (Jiangyin) Corporation
Hanlung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING THE SAME
Publication number
20220076943
Publication date
Mar 10, 2022
SJ Semiconductor (Jiangyin) Corporation
Jiashan Yin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING THE SAME
Publication number
20220077092
Publication date
Mar 10, 2022
SJ Semiconductor(Jiangyin) Corporation
Jiashan Yin
H01 - BASIC ELECTRIC ELEMENTS