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Xingyu LIU

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  • Guangzhou, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Substrate bonding method
    • Patent number 12,266,623
    • Issue date Apr 1, 2025
    • SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
    • Yunzhi Ling
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SUBSTRATE BONDING METHOD
    • Publication number 20240038705
    • Publication date Feb 1, 2024
    • Institute of Semiconductors, Guangdong Academy of Sciences
    • Yunzhi LING
    • H01 - BASIC ELECTRIC ELEMENTS