Xinhua Wang

Person

Hangzhou, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semi-conductor package structure
- Patent number 11,710,713
- Issue date Jul 25, 2023
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor package structure
- Patent number 11,257,778
- Issue date Feb 22, 2022
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor package structure
- Patent number 10,720,400
- Issue date Jul 21, 2020
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor package structure
- Patent number 10,490,522
- Issue date Nov 26, 2019
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor package structure
- Patent number 10,224,302
- Issue date Mar 5, 2019
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor package structure
- Patent number 9,659,895
- Issue date May 23, 2017
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NOVEL HINGE AND INWARD-FOLDING FLEXIBLE SCREEN MOBILE TERMINAL
- Publication number 20240044360
- Publication date Feb 8, 2024
- Hangzhou Amphenol Phoenix Telecom Parts Co., Ltd.
- Qiangqiang ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HINGE WITH LIFTING DRIVE CONTROL FUNCTION, AND INWARD-FOLDING FLEXI...
- Publication number 20240040021
- Publication date Feb 1, 2024
- Hangzhou Amphenol Phoenix Telecom Parts Co., Ltd.
- Guoping YAO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR IMPROVING MAGNETIC PROPERTIES OF CERIUM-YTTRIUM-RICH RAR...
- Publication number 20220344081
- Publication date Oct 27, 2022
- Zhejiang University
- Jiaying Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR PACKAGE STRUCTURE
- Publication number 20220173065
- Publication date Jun 2, 2022
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR PACKAGE STRUCTURE
- Publication number 20200243471
- Publication date Jul 30, 2020
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR PACKAGE STRUCTURE
- Publication number 20190123010
- Publication date Apr 25, 2019
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR PACKAGE STRUCTURE
- Publication number 20180323164
- Publication date Nov 8, 2018
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR PACKAGE STRUCTURE
- Publication number 20180096959
- Publication date Apr 5, 2018
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR PACKAGE STRUCTURE
- Publication number 20170005061
- Publication date Jan 5, 2017
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS

Xinhua Wang

Person

Patents Grantslast 30 patents

Semi-conductor package structure

Semi-conductor package structure

Semi-conductor package structure

Semi-conductor package structure

Semi-conductor package structure

Semi-conductor package structure

Patents Applicationslast 30 patents

NOVEL HINGE AND INWARD-FOLDING FLEXIBLE SCREEN MOBILE TERMINAL

HINGE WITH LIFTING DRIVE CONTROL FUNCTION, AND INWARD-FOLDING FLEXI...

METHOD FOR IMPROVING MAGNETIC PROPERTIES OF CERIUM-YTTRIUM-RICH RAR...

SEMI-CONDUCTOR PACKAGE STRUCTURE

SEMI-CONDUCTOR PACKAGE STRUCTURE

SEMI-CONDUCTOR PACKAGE STRUCTURE

SEMI-CONDUCTOR PACKAGE STRUCTURE

SEMI-CONDUCTOR PACKAGE STRUCTURE

SEMI-CONDUCTOR PACKAGE STRUCTURE