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Shanghai, CN
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Patent Application
ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING...
Publication number
20240421025
Publication date
Dec 19, 2024
Intel Corporation
Lianchang DU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
FULLY SYMMETRIC SOCKET PIN ARRANGEMENT
Publication number
20240413550
Publication date
Dec 12, 2024
Intel Corporation
Chenghai Yan
H01 - BASIC ELECTRIC ELEMENTS