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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package structure and packaging method thereof
Patent number
11,721,686
Issue date
Aug 8, 2023
Yangtze Memory Technologies Co., Ltd.
Peng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate structure, and fabrication and packaging methods thereof
Patent number
11,694,904
Issue date
Jul 4, 2023
Yangtze Memory Technologies Co., Ltd.
XinRu Zeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure and manufacturing method thereof
Patent number
11,688,721
Issue date
Jun 27, 2023
Yangtze Memory Technologies Co., Ltd.
XinRu Zeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure with stacked chips and manufacturing method...
Patent number
11,133,290
Issue date
Sep 28, 2021
Yangtze Memory Technologies Co., Ltd.
XinRu Zeng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MEMORY SYSTEM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240178089
Publication date
May 30, 2024
Yangtze Memory Technologies Co., Ltd.
Xinru ZENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
Publication number
20230343773
Publication date
Oct 26, 2023
Yangtze Memory Technologies Co., Ltd.
Peng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230275070
Publication date
Aug 31, 2023
Yangtze Memory Technologies Co., Ltd.
XinRu Zeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE STRUCTURE, AND FABRICATION AND PACKAGING METHODS THEREOF
Publication number
20230268197
Publication date
Aug 24, 2023
Yangtze Memory Technologies Co., Ltd.
XinRu Zeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY SYSTEM PACKAGING STRUCTURE, AND METHOD FOR FORMING THE SAME
Publication number
20230209842
Publication date
Jun 29, 2023
Yangtze Memory Technologies Co., Ltd.
XinRu Zeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
Publication number
20220278089
Publication date
Sep 1, 2022
Yangtze Memory Technologies Co., Ltd.
Peng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
Publication number
20220254755
Publication date
Aug 11, 2022
Yangtze Memory Technologies Co., Ltd.
Xinru ZENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE STRUCTURE, AND FABRICATION AND PACKAGING METHODS THEREOF
Publication number
20220238351
Publication date
Jul 28, 2022
Yangtze Memory Technologies Co., Ltd.
XinRu Zeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20210384166
Publication date
Dec 9, 2021
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
XinRu Zeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20210167039
Publication date
Jun 3, 2021
Yangtze Memory Technologies Co., Ltd.
XinRu Zeng
H01 - BASIC ELECTRIC ELEMENTS