Xiping Peng

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Dongguan, CN

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE
- Publication number 20240321718
- Publication date Sep 26, 2024
- Huawei Technologies Co., Ltd
- Xiping PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Substrate, Semiconductor Device, and Electronic Device
- Publication number 20240014122
- Publication date Jan 11, 2024
- Huawei Technologies Co., Ltd
- Xiping Peng
- H01 - BASIC ELECTRIC ELEMENTS